Shinku
Online ISSN : 1880-9413
Print ISSN : 0559-8516
ISSN-L : 0559-8516
Volume 39, Issue 6
Displaying 1-6 of 6 articles from this issue
  • High Temperature Metallization and Active Brazing Method
    Yoshinori HATTORI, Masato TANIGUCHI, Atushi INAGAKI
    1996 Volume 39 Issue 6 Pages 269-276
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
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  • Tsuneo MANABE
    1996 Volume 39 Issue 6 Pages 277-283
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
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  • Hiroshi IKAMI, Syuichiro KATO
    1996 Volume 39 Issue 6 Pages 284-287
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
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  • Mitsuyoshi NAKATANI, Takao OHTSUKA, Morihiko OHSAWA, Hiroyuki NAKAJIMA ...
    1996 Volume 39 Issue 6 Pages 288-294
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
    The electro chemical buffing stainless steel is used for the equipment and the pipes in the manufacturing process of the semiconductors, vacuum chambers, foods, and medical. Welding is necessary when assembling the manufacturing equipment, but oxidation and fume adhering which arise near the welding line cause a remarkable drop in surface smoothness and corrosion resistance.
    We are developing the Oxidation-Control and Fume-Free Welding Technology for the vessels of manufacturing equipment.
    In this paper, we reported the Oxidation-Control TIG Welding Method in the welding chamber in which atmosphere is controlled. And then, the reduction of the amount of fume and the Fume-Free TIG Welding Method using fume suction nozzle in the welding chamber is reported.
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  • An Example of the Adhesion between a Metal Thin Film and a Polymer Substrate
    Satoru IWAMORI, Takehiro MIYASHITA, Shin FUKUDA, Nobuhiro FUKUDA, Kazu ...
    1996 Volume 39 Issue 6 Pages 295-301
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
    Oxygen plasma treatment is known to be effective in improving the adhesive strength between Cu thin films and polyimide (pyromellitic dianhydride-oxydianiline) substrates. FT-IR analysis, and XPS analysis were used to investigate the chemical bonding state the plasma treated polyimide surface. It was found that the surface was oxdized and imide moieties and C=O moieties were reduced. The relationship between the adhesive strength and these reductions is discussed.
    In order to improve the adhesive strength after heat treatment at 150°C in air between Cu thin films and polyimide substrates, several types of interlayer were introduced at the interface between the Cu thin film and polyimide substrate. Some of the interlayers were effective in improving the adhesive strength after the heat treatment. By using an ITO interlayer, we succeeded in maintaining a peel strength between the Cu thin film and the polyimide substrate of more than 0.08 N/m even after heat treatment at 150°C inair for 3days.
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  • Seiichirou KASHU, Yasuo MIHARA, Chikara HAYASHI
    1996 Volume 39 Issue 6 Pages 302-305
    Published: June 20, 1996
    Released on J-STAGE: September 29, 2009
    JOURNAL FREE ACCESS
    Download PDF (1068K)
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