Software for the automatic extraction of intergranular failures from a mixed mode of inter-granular and transgranular ones is developed based upon computer image processing and pattern recongnition techniques. Without human assistance, calculations of intergranular fracture area fractions can be done quickly and accurately by computing co-occurrence matrices. Using this technique, the influences of stress cycle frequency on dynamic SCC crack growth, and those of stress wave form on cyclic SCC crack growth are investigated in a high-strength steel, 300M (σ
B=1310 MPa), sentitive to hydrogen embrittlement type SCC. At higher stress cycle frequencies of f≥30 Hz, threshold values, K
DSCC, are smaller than the static SCC threshold, K
ISCC. However, at lower stress cycle frequencies of f≤5 Hz, the repassivation of oxide films becomes dominant, resulting in an increase in K
DSCC up to K
ISCC. Threshold values for cyclic SCC crack growth are independent of stress wave form, including superimposed waves. At intermediate stress intensity factor ranges, however, crack growth rates increase with increasing stress rise time. In the case of a superimposed wave, a negative pulse wave with a superposition of small vibratory stresses, crack growth rates are much accelerated by promoted dissolution at the crack tips.
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