Stress corrosion cracking (SCC) of pure copper has been under investigation for over 30 years. Various researchers have reported that Cu fails via a tarnish-rupture mechanism. Recently, the strain rate sensitivity of SCC on Cu alloys was studied using the slow strain-rate test (SSRT). This method may not be adequate to verify the validity of the tarnish-rupture mechanism because of the slow strain rates employed. In the present study, the crack initiation and growth mechanisms operating during SCC of pure Cu were studied. The specimens used were manufactured from 99.9wt. % vacuum-annealed Cu. The corrosive medium was 3.0 kmol. m
-3 NaNO
2 solution at 293±3 K. A range of dipping times (t
P), holding times (t
H), and total strain (ε
T) were utilized. In this context, t
P is the time for which the specimen was dipped in the solution prior to the start of the strain application, t
H is the time for which the specimen is held while being subjected to a fixed amount of strain E and ε
T is the total strain applied to the specimen during step-strain testing (SST). The results can be summarized as follows. Three different modes could be identified through SST. These modes were classified as A, B and C in this study. In type A, no cracking occurred in the Cu even though a film formed on the Cu surface. In type B, the crack formed but did not propagate through the depth. In type C, the crack propagated through the specimen thickness and then grew along grain boundaries. It was also found that SST was capable of generating more severe conditions than SSRT. This is illustrated by comparing the stress-strain curves to failure for SSRT and SST.
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