Surface crack growth behavior from pre-indentations of HIP-Si
3N
4 was observed under Rolling contact fatigue (RCF), and also under cyclic shear load. Near surface contact stress distributions were calculated by Hanson's analytical method, and the crack growth behavior was discussed in terms of stress intensity factors under rolling contact fatigue. It was found that the cracks grew in Mode II by shear stress (ΔK
II=3.0MPa·m
1/2, K
IImax= 1.5MPa·m
1/2 stress ratio R=-1). In order to confirm the effects of shear stress on surface crack growth, crack propagation tests under cyclic shear stress were carried out when the ΔK
II=2.4MPa·m
1/2 was lower than that of RCF. We found the following three features concerning Mode II crack growth. (1) The cracks grew by cyclic shear stress in Mode II (ΔK
II=2.4MPa·m
1/2). (2) Under the same ΔK
II=2.4MPa·m
1/2, the cracks grow more when K
II max=2.4 MPa·m
1/2 (R=0) than when K
IImax=1.2 (R=-1), (3) The cracks tend to stop growing when ΔK
II is lower than 1.2 MPa·m
1/2 (R=0). Comparing the features of Mode II crack growth obtained from the torsion fatigue tests and the RCF cracks, we conclude that the surface cracks are propagated in mode II (ΔK
II=3.0 MPa·m
1/2) under rolling contact fatigue.
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