Proceedings of Microelectronics Symposium

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MES2013

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MES2013

Adsorption behavior of poly(ethylene glycol) in the presence of different kinds of halide ions with a microfluidic device

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 217-220
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_217

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Correlation between produced cuprous ion concentrations and via filling profiles by controlling periodical reverse current parameter

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 221-224
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_221

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Analysis of Cu(I) in Copper Sulfate Electroplating Bath and Evaluation of Plated Film

[in Japanese], [in Japanese], [in Japanese]

Pages 225-228
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_225

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Study of Blind Viahole Filling Capability of Sn Plating

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 229-232
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_229

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Development of Optical Three Dimensional Measurement Method for Cone Shape Micro Bumps Prepared Specially in 3D LSI Chip Stacking System

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 233-236
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_233

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Study of Voidfree Bonding by 3D-IC Bonding Underfill Film

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 237-240
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_237

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Analyses of 3D die-stack package: thermal stress and electromigration

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 241-244
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_241

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Interconnect Optimization Method for High-speed Signal Transmission of 10Gbps and Beyond

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 245-248
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_245

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Cooperation Analysis and Demonstration Test for Modularization of 5 GHz-band Power Amplifier

[in Japanese], [in Japanese], [in Japanese]

Pages 249-252
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_249

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Evaluation for Ultra-Wideband Ultra-Low Power Distribution Network Impedance of Decoupling Capacitor Embedded Interposers by Electromagnetic Field Analysis

[in Japanese], [in Japanese]

Pages 253-256
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_253

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Positive Feedback Coil by Dispersion Capacitive Coupling:Sensitivity Improvement of Electric Field Sensor for Intra-body Communication

[in Japanese], [in Japanese]

Pages 257-260
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_257

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Hierarchical Surface Modification of Self-Resilience Bio-Interface Materials by Low Pressure Plasma

[in Japanese], [in Japanese]

Pages 261-264
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_261

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Room Temperature Bonding of Wafers using a-Si and a-Ge Films

[in Japanese], [in Japanese], [in Japanese]

Pages 265-268
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_265

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Feasibility study of micro-solder bumping with Injection Molded Solder technology

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 269-272
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_269

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Development of Method of Reflow Profile Simulation

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 273-276
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_273

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Low temperature direct bonding of Cu to Cu using formic acid treatment with Pt catalyst

[in Japanese], [in Japanese], [in Japanese]

Pages 277-280
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_277

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Optimization of process conditions in Ag Direct Bonding

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 281-284
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_281

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Development of Low Temperature Bonding Technology and Die Bonding Equipment using Sintering of Fine Metal Particles

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 285-288
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_285

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Effect of Lubricants Absorbed on Silver Fillers on Electrical Conductivity of Isotropic Conductive Adhesives (ICAs)

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 289-292
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_289

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The Formation of SAP Substrate using Superheated Steam Treatment

[in Japanese], [in Japanese]

Pages 293-296
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_293

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Study of new removal technique by use of magnetic polishing method of copper overhang generated in the direct laser via process

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 297-300
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_297

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Development of High Density Wiring Substrates Based on Cu-filled Anodic Aluminum Oxide

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 301-304
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_301

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Development of the Next Generation Buried Bump Interconnection Technology (B2itTM) to Realize Finer Bump, Finer Line/Space, Thinner Substrate and Higher Speed Signal Transmission

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 305-308
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_305

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Discovery and Mechanism Identification of Ag-Dendrite in Alumina Grain Boundary at low temperature

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 309-312
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_309

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The Failure analysis System using for Solution

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 313-316
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_313

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Improvement of the application of the simple delamination test to semiconductor package reliability development

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 317-320
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_317

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Stress Reduction in Electronics Devices by Epoxy-Silicone Rubber Composite Joint

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 321-324
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_321

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Warpage Analysis of Multi-Layered Substrate Considering the Vary of Viscoelastic Material Properties of Resin under Heat Cycle

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 325-328
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_325

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Non-halogen, low VOC and one-liquid type new deflux cleaning system enables waterrinse free process

[in Japanese]

Pages 329-330
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_329

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Infrared inspection system INSPECTRA-IR enables fully automated defect inspection of Si structures.

[in Japanese]

Pages 331-332
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_331

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Processing technology of Sugakuart

[in Japanese], [in Japanese], [in Japanese]

Pages 333-334
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_333

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High-throughput multi-axis TCB(Thermal Compression Bonding) HTB-6

[in Japanese], [in Japanese]

Pages 335-336
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_335

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Compression molding technology whose adoption to semiconductor devices is increasing

[in Japanese]

Pages 337-338
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_337

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Study of the thermal conductivity measurement with steady state comparativelongitudinal heat flow method

[in Japanese]

Pages 339-340
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_339

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The low temperature and the short-time hardening adhesives for electronic device mounting

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 341-342
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_341

CONFERENCE PROCEEDINGS FREE ACCESS

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Single nozzle head for ink-jet process development

[in Japanese]

Pages 343-344
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_343

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The CAD/CAM technology for Device Embedded Substrate, and expectations for The FUJIKO format.

[in Japanese]

Pages 345-346
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_345

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Problems and Measures of CAD Tool for Designing Device Embedded Substrates

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 347-348
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_347

CONFERENCE PROCEEDINGS FREE ACCESS

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Improvement of Plated Copper Adhesion in Glass Interposer Application

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 349-350
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_349

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Production process of all wet metallized non-adhesive type flexible copper clad laminate; ELFSEED

[in Japanese], [in Japanese], [in Japanese]

Pages 351-352
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_351

CONFERENCE PROCEEDINGS FREE ACCESS

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Use and the effect of a heat insulating material (Paste which takes heat) of avoiding the heat influence on the electronic components in a soldering process

[in Japanese]

Pages 353-354
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_353

CONFERENCE PROCEEDINGS FREE ACCESS

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New material for fine patterning package substrates by semi-additive process (PF-EL, AirFoil)

[in Japanese]

Pages 355-356
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_355

CONFERENCE PROCEEDINGS FREE ACCESS

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Simultaneous Press Process with Embedded Devices and Innovative PCB Process of Ultra-Multiple-PCB

[in Japanese]

Pages 357-358
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_357

CONFERENCE PROCEEDINGS FREE ACCESS

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ADFLEMA of low dielectric characteristic adhesive film

[in Japanese], [in Japanese], [in Japanese]

Pages 359-360
Published: 2013
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.23.0_359

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (328K)

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