In this study, we report novel polymer alloy which has high heat resistant and low CTE. In our previous study, 4,4’-bismaleimide diphenyl methane (BMI) and P-d-type benzoxazine (P-d) were allowed to react in order to obtain a high heat resistance resin. However, the disadvantages in this case were the high processing temperature (>160℃) and the narrow process window (the narrow temperature range available for processing). Thus in this research, we addressed these problems by copolymerizing bisphenol A dicyanate ester, which has a low melting point and high heat resistance, with BMI and P-d. The optimum equivalent ratio and curing conditions were determined from the processability and thermal properties of the resins. As a result, this ternary alloy resin realized low processing temperature at 120°C and viscosity of 23 mPa・s, while those of our previous system (BMI+P-d) were 160°C and 36,000 mPa・s, respectively. The cured resin has a
Tg of more than 250℃, a CTE of less than 50 ppm/K, and higher flexural strength than that of conventional epoxy resins, thus satisfying the requirements for an encapsulation material to be used in SiC semiconductors.
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