Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Volume 37, Issue 6
Displaying 1-5 of 5 articles from this issue
Original
  • Junichi Kamei, Yoshinori Nagai
    2016Volume 37Issue 6 Pages 236-241
    Published: November 10, 2016
    Released on J-STAGE: January 24, 2017
    JOURNAL FREE ACCESS

    We have used trans-esterification and developed the manufacturing technology for (meth)acrylates. Dicyclopentenyl acrylate synthesized by trans-esterification had lower ionic impurities and lower skin irritation. It was kept in 60℃ while 6 months, then its color and acid value was little increased. Dicyclopentenyl methacrylate had high Tg. It was indicated that the double bond in five-menbered ring of the monomer reacted in UV curing process to form cross-link.

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  • Masayuki Katagiri, Shinpei Iwamoto, Yoshihiro Yasuda, Hiroki Hasegawa, ...
    2016Volume 37Issue 6 Pages 242-252
    Published: November 10, 2016
    Released on J-STAGE: January 24, 2017
    JOURNAL FREE ACCESS

    In the thin film system of 1,1-bis(4-cyanatophenyl)ethane including silica filler, it could be cured fast with aromatic diamines such as bis(3-aminophenyl)sulfone, 1,3-bis(3-aminophenoxy)benzene (APBN) and 1,3-bis[2-(4-aminophenyl)-2- propyl] benzene, and the cured products had glass transition temperature above 220℃ and tensile shear adhesion strength about 10MPa. In our experiment, the aromatic diamines of the lower pKb showed the stronger cure catalysis. In comparison with novolak type cyanate ester resin derived from fomaldehyde and phenol (NVCN), that derived from acetaldehyde and phenol (E-CN-M)showed lower viscosity that leads to better handling in the lower molecular weight region (Mw<1000). Synopsis In the thin film system of 1,1-bis(4-cyanatophenyl)ethane including silica filler, it could be cured fast with aromatic diamines such as bis(3-aminophenyl)sulfone, 1,3-bis(3-aminophenoxy)benzene (APBN) and 1,3-bis[2-(4-aminophenyl)-2- Furthermore, the cured product of E-CN-M in this region (Mw<1000) showed higher initial and long term heat resistance than NVCN. It was also shown that introduction of furan moiety to the bridging methylene in the novolak type cyanate ester resin enhanced long-term heat resistance.

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  • Masahiro Komeda, Kozo Matsumoto, Takeshi Endo
    2016Volume 37Issue 6 Pages 253-259
    Published: November 10, 2016
    Released on J-STAGE: January 24, 2017
    JOURNAL FREE ACCESS

    Binary mixture materials were prepared by mixing cross-linked polystyrene and liquid polybutadiene by several methods and their shapes and thermal phase transition behaviors were examined. Evaporating dichloromethane of crosslinked polystyrene and polybutadiene (1/1 wt/wt) solution in dichloromethane at 40 ℃ under reduced pressure gave solid/liquid two-phase-separated materials. Differential scanning calorimetry (DSC) of the materials showed that they had two glass transition temperature (Tg)s, one was Tg(-91.0 ℃) attributed to polybutadiene and the other was Tg (103.1 ℃) attributed to polystyrene. They coincided well with those of original polybutadiene and cross-linked polystyrene, respectively. On the other hand, freeze-drying of the cross-linked polystyrene and polybutadiene (1/1 wt/wt) solution in 1,4-dioxane gave powdered solid materials. DSC analysis of these materials revealed higher temperature shift of polybutadiene Tg (-88.8 ℃) along with lower temperature shift of polystyrene Tg (97.8 ℃). These observations indicated that binary materials with quite different shapes and properties can be prepared by varying the mixing methods.

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  • Yuka Yoshida, Tanaka Kenji, Hideyuki Katagi, Shinichi Kosugi, Haruaki ...
    2016Volume 37Issue 6 Pages 261-265
    Published: November 10, 2016
    Released on J-STAGE: January 24, 2017
    JOURNAL FREE ACCESS

    The mesogenic epoxy monomer forming smectic phase has high melting point. We enabled the molding of the mesogenic epoxy composite by lowering a melting point by reacting the mesogenic epoxy monomer with resorcinol or hydroquinone partially. The mixture of mesogenic epoxy monomers and the prepolymers formed the higher order structure and maintained it even if the stoichiometric phenolic quantity for the epoxy increased to 0.5. The glass transition temperature of the cured material did not decrease even if the phenolic quantity was increased to 0.15. The thermal conductivity of the composite transfer molded with partial mesogenic epoxy/resorcinol prepolymer of epoxy/phenol stoichiometric ratio 10/1 was 8.9 W/(m・K) when the filler content was 76 vol%. In the case of the partial mesogenic epoxy/hydroquinone prepolymer of the same phenolic ratio, the thermal conductivity of the composite was 10.5 and 11.7 W / (m・K) when the filler content is 76 and 78 vol%, respectively. It was confirmed that the X-ray diffraction peaks of these molded materials were attributable to the smectic structure of the resin.

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