Changes in gate threshold voltage (
VT), carrier mobility (μ), and low-frequency-noise characteristics have been investigated for
n-channel MOSFET's, into whose channel region
11B
+,
27Al
+,
28Si
+ and
31P
+ ions were implanted through their gate oxide film.
In case of Si implantation, a slight decrease in μ still remained after 15min. anneal at 950°C, while no significant change was observed in
VT or in noise characteristics. Introduction of acceptor ions resulted in a substantial decrease in μ, and an increase in low-frequency noise level. The shift in
VT was found to be proportional to implantation dose up to 10
12 cm
-2 in case of B
+ and P
+ implantation.
It is possible to detect the effct of radiation damages from the changes in
VT of MOS-FET's. From the annealing behavior of Si
+ implanted MOSFET, the activation energy of annihilation of such radiation damages was obtained to be 0.35 eV.
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