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Koji Arimitsu, Hiroshi Kobayashi, Takahiro Gunji, Yoshimoto Abe, Kunih ...
2005 Volume 18 Issue 2 Pages
171-172
Published: 2005
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Koji Arimitsu, Satoru Inoue, Takahiro Gunji, Yoshimoto Abe, Kunihiro I ...
2005 Volume 18 Issue 2 Pages
173-174
Published: 2005
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Youichi Higuchi, Toshikazu Segawa, Masaaki Kurihara, Daisuke Totsukawa
2005 Volume 18 Issue 2 Pages
175-180
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The binary hologram master for hologram color filter was developed and evaluated in their characteristics. The chirped diffraction grating was fabricating by electron-beam lithography. This manufacturing process is consist from a volume hologram master and contact copy process. Hologram Color Filter (HCF) is a hologram optical element (HOE) of RGB colors for a Liquid Crystal (LC) projection TV. The mass production of such HOEs is possible by the development of a precise replication technology from EB lithographed elements.
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Hideo Horibe, Tomosumi Kamiura, Kunio Yoshida
2005 Volume 18 Issue 2 Pages
181-185
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This study developed a new method for removing positive-tone diazonaphtho- quinone/novolak resist. The fourth harmonic wave (&lamda;=266nm) of a pulse Nd
3+:YAG laser was used. Ablation occurred at the resist surface when it was irradiated with over 35mJ/cm
2. The amounr of removed resist increased with an increase in the laser energy, and it was possible to remove a 250nm thick resist layer by one pulse irradiation with 94mJ/cm
2. Resist with an initial thickness of 1100nm and could be completely removed with no damage to the Si wafer after being irradiated seven times with 94mJ/cm
2. The XPS measurement indicated that the residual amount of carbon from the Si surface irradiated by a laser under the vacuum was almost same to that from a Si wafer without resist coating. Resist removal method by laser is environmentally sound and will contribute to energy reduction.
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Kieko Harada, Masahito Kushida, Shinichi Miyakawa, Shigeru Takahara, K ...
2005 Volume 18 Issue 2 Pages
187-192
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Photo and thermal decompositions of a diphenylamine-4-diazonium sulfate/formaldehyde condensate (DSR) / polyvinyl alcohol (PVA) resist containing a little polyvinyl acetate (PVAc) units :DSR/PVA emulsion film: were supressed by forming a complex with 18-crown-6 (18C6) at the diazo group, while both decompositions of the DSR/PVA emulsion film with polyethylene glycol 300 (PEG) which includes the benzene ring of the diazo compound was accelerated. Photo decomposition rate of the DSR/PVA resist with β-cyclodextrin (CD) which includes also the benzene ring of the diazo compound did not change, but thermal decomposition was suppressed. The DSR-PVA emulsion film showed blue color. The coloring of the DSR-PVA emulsion films was suppressed by inclusion of 18C6 or PEG.
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Hiroshi Morita, Hitomi Ishikura
2005 Volume 18 Issue 2 Pages
193-198
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Under UV light irradiation, a gaseous mixture of allyltrimethylsilane (2-propenyltri- methylsilane) (ATMeSi) and iron pentacarbonyl (Fe(CO)
5) produced crystalline deposits as the major product in addition to a small amount of sedimentary aerosol particles. The crystalline deposits were mainly composed of Fe(CO)
5 photo-products, and they grew on glass and copper substrates during UV light irradiation. A gaseous ternary mixture of ATMeSi, Fe(CO)
5, and carbon disulfide (CS
2) produced sedimentary aerosol particles as the major product. FT-IR spectrum of the sedimentary aerosol particles showed the characteris- tic bands ascribed to photo-products from ATMeSi, Fe(CO)
5, and CS
2, and chemical species of the sedimentary aerosol particles were different from those of the deposits produced from the gaseous binary mixture. With decreasing partial pressure of CS
2, particles deposited on the substrate tended to melt and collapse in each other, and finally formed a film after prolonged UV irradiation. Photochemical reactions induced from CS
2 molecules were responsible to form aerosol particles.
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Masamitsu Shirai, Kazuyuki Mitsukura, Haruyuki Okamura, Masahiro Miyas ...
2005 Volume 18 Issue 2 Pages
199-202
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Kimihiro Matsukawa
2005 Volume 18 Issue 2 Pages
203-210
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Organic/inorganic nano-hybrids are molecularly dispersed composite materials with polymers and metal oxides. As these materials have excellent transparency, they are expected to be applied for the optical usage. In particular, organic/inorganic hybrids with photo-functional polymers would be interesting materials with optical properties. Polysilanes are one of photo-functional polymers, whose functions are photodegradation, photoconductive, high refractive index, etc. We have been investigating about the preparation and properties of the novel nano-hybrids of polysilane with inorganic substances. Polymethylphenylsilane (PMPS)/silica or titania nano-hybrid thin films were prepared by a sol-gel reaction with PMPS block copolymers and corresponding metal alkoxides. The refractive index of nano-hybrid thin films could be controlled with the composition ratio of PMPS. After development of the UV-irradiated hybrid thin films with organic solvents, nano porous (ca. 20 nm) silica or titania thin films were obtained by removing the decomposed PMPS segments, and a high refractive index difference occurred between irradiated and non-irradiated part in the hybrid thin films. Furthermore, a hybrid thin film of polydihexylsilane (PDHS) and zirconia suppressed the thermochromism which is known as a characteristic of polydialkylsilane, and this hybrid thin film provided the high thermo-optic (TO) effect with an advantage for optical devices.
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Yoichi Shindo, Yoshihiko Sato
2005 Volume 18 Issue 2 Pages
211-212
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Haruyuki Okamura, Kazuyuki Mitsukura, Masamitsu Shirai, Tsuyoshi Fujik ...
2005 Volume 18 Issue 2 Pages
213-220
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Photocrosslinking properties of fluorene-9,9'-bis(4-ethoxyphenyl vinyl ether) (FBPEVE) /fluorene-9,9'-bis(4-phenoxyethyl glycidyl ether) (FBPEG) blend and FBPEVE/poly (glycidyl methacrylate) (PGMA) blend were investigated. Photocrosslinking of FBPEVE/PGMA or FBPEVE/FBPEG blended films containing a photoacid generator (PAG) was observed at lower irradiation dose than that of PGMA, FBPEG, or FBPEVE. The high sensitivity of blended films is due to the enhancement of the conversion of both epoxy and vinyloxy moieties compared with the conversion of simple epoxy in FBPEG or vinyloxy moiety in FBPEVE. The photocrosslinked films showed good thermal stability.
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Tadahiro Ohba, Kanji Suyama, Masamitsu Shirai
2005 Volume 18 Issue 2 Pages
221-224
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Kyosuke Isoda, Koji Arimitsu, Takahiro Gunji, Yoshimoto Abe, Kunihiro ...
2005 Volume 18 Issue 2 Pages
225-226
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Koji Arimitsu, Yusuke Ito, Takahiro Gunji, Yoshimoto Abe, Kunihiro Ich ...
2005 Volume 18 Issue 2 Pages
227-228
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Kazuki Akamatsu, Takeo Yamaguchi
2005 Volume 18 Issue 2 Pages
229-232
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Tatsuhiko Yajima, Takamasa Suzuki
2005 Volume 18 Issue 2 Pages
233-236
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Halen M. L. Tan, Takuya Ikeda, Takanori Ichiki
2005 Volume 18 Issue 2 Pages
237-241
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A three-dimensional scanning microplasma jet etcher (3D-SMPJE) which works independently of x, y and z axes and enables localized and ultra high-rate silicon wafer etching has been developed. In this paper, the 3D-SMPJE was investigated for its fundamental characteristics and then three-dimensional microfabrications were carried out using Ar/SF
6 etching gases on silicon (Si) wafers. It is shown that by controlling L and etching time, one can obtain reproducible etched profiles. In addition, with this novel technology, maskless patterning and precise three-dimensional micromachining with smooth surfaces were achieved.
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Masaaki Katoh, Yuki Ogata, Takeo Ohte, Akira Kojima
2005 Volume 18 Issue 2 Pages
243-244
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Richard d'Agostino
2005 Volume 18 Issue 2 Pages
245-249
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The utilization of flow pressure plasma technology for some industrial applications in the field of polymer modification for biomedical applications is described. The use of process control diagnostics for implementing on-line processes will be discussed. The following processes will be discussed: deposition of super-hydrophobic and nano- micro-structured coating, non fouling and bacterial resistant coatings, -COOH functional coatings, micropatterned surfaces, anti-bacteric coatings.
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Atsumu Shoji, Tetsuya Adachi, Masahiro Tsuchiya, Motoi Fujishima, D. S ...
2005 Volume 18 Issue 2 Pages
251-254
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Plasma treatments of polyethylene surfaces with halogens, especially bromine and iodine were investigated. In addition, after halogen plasma treatment had been done, the treated substrate was exposed to the vapor of same halogen to increase the contents of the halogen in the substrates. From the results by ESCA analysis, it became apparent that the bromine and the iodine had been bonded chemically into the surface of polyethylene substrate. The reaction of I
2-plasma-treated polyethylene with amino alcohol solution made the substrate hydrophilic.
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Shu Seki, Satoshi Kawachi, Seiichi Tagawa, Akihiko Egami, Kazuaki Kuri ...
2005 Volume 18 Issue 2 Pages
255-256
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Kiyomi Matsuda, Hirotaka Yamamoto, Ayumi Kashiwada, Kazunori Yamada, M ...
2005 Volume 18 Issue 2 Pages
257-262
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Poly(tetrafluoroethylene) (PTFE) plates grafted with N-isopropylacrylamide (NIPAAm) were prepared by combined use of the plasma treatment and photografting. The surface compositions of the grafted PTFE plates were analyzed by ESCA and thermo-responsive properties were investigated by contact angle measurements and ellipsometry. Since the contact angle values of the grafted PTFE plates decreased with an increase in the grafted amount of NIPAAm, it is considered that the wettabilities of the grafted PTFE surfaces come from the hydrophilicity of the grafted polymer chains. At the temperatures above the LCST of PNIPAAm the wettabilities of the grafted PTFE plates were lowered due to the contraction of the grafted polymer chains through hydrophobic interaction. The grafted amount of NIPAAm increased most in a monomer aqueous solution, but the most pronounced thermo-sensitivity was observed in an acetone solution. The highest grafted amount of NIPAAm and thermo-sensitivity were obtained in the monomer solution with the composition of acetone : water = 80 : 20 wt%. Further, the grafted layers of PNIPAAm onto PTFE evaluated by ellipsometry became thick and even with an increase in the grafted amount.
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Masanori Mizuno, Shinya Kato, Shinzo Morita
2005 Volume 18 Issue 2 Pages
263-266
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Cu dispersed C-S dielectric thin film is produced by performing simultaneously the plasma CVD of CH
4, SF
6, and Ar mixture gas, and the sputtering of Cu plate discharge electrode. The C-S film was supposed to be formed by HF dissociation reaction in the plasma CVD process. Effect of substrate holder temperature on the deposition was studied. With increasing the temperature, sulfur content was decreased but oxygen content was increased. At 400°C, the sulfur content became negligibly small. X-ray diffraction of Cu dispersed C-S dielectric thin film showed no peak caused on Cu cluster. Because oxygen was not mixed in the reaction gas, large oxygen content was referred to oxidization of atomically dispersed Cu atom in the film in the air.
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Yu Iriyama, Hiroki Uwajima
2005 Volume 18 Issue 2 Pages
267-272
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Methane and ethylene were plasma-polymerized onto polyethylene (PE) and polypropylene (PP) substrates. Several properties of the deposited films, such as deposition behavior, density, oxygen permeability, and adhesivity, were investigated. The deposition rate of ethylene was found to be about 4-5 times greater than that of methane. The density of plasma-polymerized ethylene was determined to be 1.00 g/cm
3. Adhesivity of plasma-polymerized ethylene films on high-density PE (HDPE) and PP was high enough when O
2 pretreatment was preceded. Without O
2 pretreatment, the adhesivity on HDPE was slightly better than that on PP, and a higher adhesivity on HDPE was observed for the film plasma-polymerized at a higher plasma-energy density with low ethylene flow rate. Oxygen permeability of plasma-polymerized low-density PE (LDPE) film was reduced considerably by the deposition of ethylene-plasma-polymer films.
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Shigeru Kurosawa, Hiroshi Harigae, Hidenobu Aizawa, Jong-Won Park, Hir ...
2005 Volume 18 Issue 2 Pages
273-276
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Masuhiro Kogoma, Kunihito Tanaka, Atushi Takeda
2005 Volume 18 Issue 2 Pages
277-280
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Yasushi Sasai, Shin-ichi Kondo, Masaki Nagato, Masayuki Kuzuya
2005 Volume 18 Issue 2 Pages
281-284
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Itoh Takashi, Shigeru Tanaka, Kanji Shimoohsako, Masaru Nishinaka, Mut ...
2005 Volume 18 Issue 2 Pages
285-288
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Takanori Fujiwara, Yoichi Shinba, Kazunori Sugimoto, Yoichi Mori, Masa ...
2005 Volume 18 Issue 2 Pages
289-295
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This paper reports that the novel high Tg low dielectric constant polymer with highly rigid coil-shaped main-chain structure was obtained for interlayer dielectric applications in microelectronics. The low dielectric constant of the polymer was induced by it that the coil-shaped main-chain structure with a bulky side-chain out of the main-chain. The coil-shaped structure leads to decrease packing density and increase free volume. The polymer was exhibited low dielectric constant (2.31) without pore. The glass transition temperature of the polymer is higher than 400°C. TGA shows that the polymer was heat stable higher than 350°C under nitrogen now. The elastic modulus of the polymer is 4.3 GPa. The film is able to be prepared with lower temperature (at solvent boiling point). The polymer prepared is novel poly(norbornene imide)s containing bulky fluorinated aryl unit in side-chain. We confirmed that the fluorinated poly(norbornene imide)s displays a coil-shaped a main-chain polymer structure by molecular simulation. The syntheses of the fluorinated poly(norbornene imide)s are described in this paper.
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Akio Takahashi, Masa-aki Kakimoto, Taka-aki Tsurumi, Jianjun Hao, Li L ...
2005 Volume 18 Issue 2 Pages
297-300
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Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfully achieved 8 nF/cm
2. By use of this nanocomposites, multilayer printed wiring boards with embedded passive components were fabricated for prototypes. High dielectric constant Barium titanate (BaTiO
3) beads surface modification based on a new concept was applied to improve the affinity between BaTiO
3 particles and polymer matrix. Next, the blend polymer of an aromatic polyamide (PA) and an aromatic bismaleimide (BMI) was employed as the matrix as from a view-point of both the processabilty during fabricating the substrates with embedded passive components and the thermal stability during assembling LSI chips. Finally, these technologies were combined and optimized for embedded capacitor materials.
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Sachiko Ito, Hirotaka Osato, Katsuya Kikuchi, Shigemasa Segawa, Kazuhi ...
2005 Volume 18 Issue 2 Pages
301-306
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In order to determine the optimal composition for thick films above 10 μm of a photosensitive imide block copolymer/sensitizer composite, we examined the dissolution rates of the exposed and unexposed area, their dissolution contrast and pattern profile during the development of films prepared using a nonprecursor-type imide block copolymer (PI 21-101) with the addition of various sensitizer concentrations of diazonaphthoquinone derivative (THBP-200) from 15 wt% to 50 wt%. The dependence of the dissolution rate on THBP-200 concentration for the ?lms not subjected to the exposing process signifies that the dissolution inhibition above 30 wt% is effective to an alkaline development solution. The dissolution contrast with 30-wt% THBP-200 was found to be 15.4, which is remarkably higher than that with THBP-200 concentrations of 15 wt% and 20 wt% that are the optimal composition for thin films. With the condition of a THBP-200 concentration of 30 wt%, the optimum composition for the present thick films, a good via-hole pattern with a hole size of 20 μm was successfully formed on a film with about 10 μm in thickness.
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Masatoshi Hasegawa, Azumi Tominaga
2005 Volume 18 Issue 2 Pages
307-312
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A low-K and low-CTE polyimide, CBDA/TFMB (CBDA = 1,2,3,4-cyclobutanetetracarboxylic dianhydride, TFMB = 2,2'-bis(trifluoromethyl)benzidine) was applied to photosensitive materials. Poly(amic acid) (PAA) of this system was modified using imide-containing diamines to control the solubility in alkaline solutions. Copolymerization using them made possible to form positive-tone fine pattern in combination with diazonaphthoquinone. Additionally it was found that this PAA film is quite soluble in some environmentally friendly (biodegradable) solvents, e.g., alcohols, glycols, and their monoalkyl ethers. PAA film containing an ionic bonding-type methacrylate and a photoinitiator gave fine negative patterns. The corresponding PI films cured from these photosensitive PAA films exhibited a low CTE, a low K, a high Tg, and high transparency comparable to the original PI film.
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Xing Zhou Jin, Hiroyuki Ishii, Shigemasa Segawa
2005 Volume 18 Issue 2 Pages
313-318
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A novel positive type photosensitive polyimide based on soluble block copolyimide (Bco-PI) with alicyclic dianhydride has been developed. The base Bco-PI was prepared by a direct one-pot polycondensation of cyclohexanetetracarboxylic dianhydride (H-PMDA), 2, 2-Bis (3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) and bis(4-(3-aminophenoxy)phenyl)sulfone (m-BAPS) in the presence of a γ-valerolactone and pyridine catalyst system and N-methyl-2-pyrrolidone(NMP) was used as solvent. The resulting film was transparent and colorless. It exhibited the cutoff at 290nm, and the refractive index was 1.55. The Tg and CTE were 278°C and 39 ppm/°C. As alicyclic dianhydride, H-PMDA, contributed to the resulting Bco-PI film with good thermal properties and excellent optical properties.
By the addition of 20wt% 1,2-Naphthoqiunonediazide-5-sulfonic acid p-cresol ester (PC5) to the Bco-PI, It was found to be a positive type photosensitive polyimide. It showed a sensitivity of 350mJ/cm
2 and a contrast of 2.42 when it was exposed to UV light, followed by development with 5% tetramethylammonium hydroxide (TMAH) aqueous solution at room temperature.
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Tomohito Ogura, Ken-ichi Fukukawa, Yuji Shibasaki, Mitsuru Ueda
2005 Volume 18 Issue 2 Pages
319-320
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Junya Kusunoki, Takashi Hirano
2005 Volume 18 Issue 2 Pages
321-325
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A negative working photosensitive polyimide (PSPI) for use as a semiconductor surface coating material has been developed. This material has been widely used as a buffer coating to protect electrical circuitry on IC chips in the semiconductor market. We have now developed a new negative working photosensitive polynorbornene (PSPNB) for Wafer Level Packaging (WLP). These cured PSPNB films have very low water absorption and low dielectric constant in addition to high adhesion to a wide range of substrates including SiO2, etc. The polymer has attractive processing properties, such as a low cure temperature, excellent dielectric properties, and desirable mechanical properties, most notably, low residual stress after cure. A discussion of the polymer properties, processing conditions and the results of the adhesion to a wide range of substrates will be presented.
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Hiroshi Matsutani, Takashi Hattori, Masayuki Ohe, Takumi Ueno, Robert ...
2005 Volume 18 Issue 2 Pages
327-332
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Polyimides are commonly used as a thermally stable insulator for semiconductors. To assure adequate chemical or physical properties, a layer of their precursors has to be cured in a convection oven at more than 300 °C. In this paper, we compare variable frequency microwave (VFM) heating with convection heating for curing various polyimide precursors and a photosensitive polyimide precursor. Then, we demonstrate that the use of VFM enables us to cure the precursor lower than the standard convection cure temperature while maintaining necessary film properties such as cyclization, T
g, T
d, and elongation.
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Shinji Ando, Yoshihara Terui, Yasuhiro Aiki, Takahiro Ishizuka
2005 Volume 18 Issue 2 Pages
333-336
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A fully aromatic unfluorinated polyimide (PI) exhibiting high transparency in the visible region and small thermal expansion was designed and prepared. The formation ability of charge transfer (CT) interactions in PIs estimated using the density functional theory clarified that polychlorine-substituted benzidines should give transparent PIs due to their low electron-donating properties. A combination of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 2,2',6,6'-tetrachloro-4,4'-diaminobiphenyl (4ClBZ) gave a PI exhibiting good transparency (52% at 420 nm and 81% at 600 nm), a high Tg (368°C), a high refractive index (1.6473 at 1.31μm) and a low CTE (13 ppm/K). This material is suitable for thermally stable, transparent, and inexpensive substrates for flexible displays and organic thin film transistors.
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Toshiharu Terui, Shinji Ando
2005 Volume 18 Issue 2 Pages
337-340
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Yoshiyuki Oishi, Naoko Yoshida, Kunio Mori
2005 Volume 18 Issue 2 Pages
341-344
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