Polymer processing technology is expected to obtain very thin components such as semiconductor packages. The thickness is needed to be less than 100×10
-6m. However, in order to fill polymer melts into the very thin cavity, large scaled pressure units are necessary, in general.
Recently, the processing methods utilizing capillary pressure of viscosity fluid are being watched with keen interest. Because, it is possible to obtain thin shapes without large scaled equipments, and contribute to reduction of manufacturing costs. So, characteristics of capillary flow were investigated for optimization of thickness design and material properties.
As a fundamental approach, specified liquid epoxy resins and heating temperatures are selected as the flowing polymer can be regarded as non-compressible isothermal Newtonian fluid. And polymer flow was analyzed by FEM (Finite Element Method). The real behaviors of polymer flow were visualized experimentally.
And the characteristics of capillary flows are explained, based on the analyses and visualizations. Furthermore, a roundabout flow characterized by capillary behaviors was pursued, and a method to shorten processing time was proposed, utilizing the roundabout flow.
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