Thermo-viscoelastic and tensile properties during the cure of adhesives used for electronic devices were evaluated. It was clarified that the dynamic viscoelastic and tensile properties depend on holding times and that these properties are affected by the curing processes. Specifically, the tensile strength and elastic modulus will increase, but the fracture strain will decrease as the heating time becomes long. These tensile properties correspond with thermo-viscoelastic behavior and fracture patterns.
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