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Naoji FURUKAWA
2000 Volume 51 Issue 11 Pages
1056-1061
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Hidetaka HAYASHI
2000 Volume 51 Issue 11 Pages
1062-1068
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Yutaka FUJIWARA, Hidehiko ENOMOTO
2000 Volume 51 Issue 11 Pages
1069-1074
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Tsutomu TAKAKI
2000 Volume 51 Issue 11 Pages
1075-1077
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Akira TERANISHI
2000 Volume 51 Issue 11 Pages
1078-1080
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Hiroshi NODA, Masahiro KANAZAWA
2000 Volume 51 Issue 11 Pages
1081-1084
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Hidehiro NAKAO
2000 Volume 51 Issue 11 Pages
1085-1087
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Makoto IWASAKI
2000 Volume 51 Issue 11 Pages
1088-1092
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Yutaka YOSHIKAWA
2000 Volume 51 Issue 11 Pages
1093-1095
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Tadashi CHIBA
2000 Volume 51 Issue 11 Pages
1096-1099
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Toshio NATORI
2000 Volume 51 Issue 11 Pages
1100-1105
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Eiichi SUGANUMA
2000 Volume 51 Issue 11 Pages
1106-1110
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Hidenori UCHI, Robert S. ALWITT
2000 Volume 51 Issue 11 Pages
1111-1116
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Nobuo OSAWA, Kiyoshi FUKUOKA
2000 Volume 51 Issue 11 Pages
1117-1120
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Yasushi IDEMOTO, Nobuyuki KOURA
2000 Volume 51 Issue 11 Pages
1121-1129
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Ryoichi ICHINO, Masazumi OKIDO
2000 Volume 51 Issue 11 Pages
1130-1135
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Hidemi NAWAFUNE, Hiroshi KITAMURA, Shozo MIZUMOTO, Ei UCHIDA, Takashi ...
2000 Volume 51 Issue 11 Pages
1142-1147
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Cooper appears to offer better conductivity and reliability in ULSI metallization than aluminum, and the current research confirms copper potential in this regard. ULSI metallization is accomplished by electrodepositing copper from ethylenediamine complex baths using the additives glycine, ammonium sulfate, and a small quantity of thiodiglycollic acid. These baths produce good throwing powder and fill trenches and contact holes on silicon wafers with giant grains of void-free copper deposits. ULSI metallization using copper produced no voids as are formed due to the absorption of polyethylene glycol in the presence of chloride ions, thus avoiding a major drawback of ULSI metallization. Results of the current research have demonstrated the potential for use of copper in ULSI metallization accomplished through electrodeposition of copper using ethylenediamine complex baths.
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Makoto YUASA, Masahiro MOROOKA, Naomi ISHIDA, Nao KAWAMURA, Isao SEKIN ...
2000 Volume 51 Issue 11 Pages
1148-1153
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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To obtain a fundamental information about the mechanism of corrosion inhibition for mild steel by polyacrylic acid systems in cooling water systems, the effects of a simple model,
i, e., a mixture system composed of polyacrylic acid and polyacrylamide (PAA/PAAm), on the corrosion of mild steel was investigated. Results indicated that the mixture system effectively inhibits corrosion. This effectiveness is attributed to the formation of polymer-polymer complex (PPC) and its action.
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Buichi ISE, Teruhito SASAKI, Hiroshi KATAGIRI, Shinsaku MEGURO
2000 Volume 51 Issue 11 Pages
1154-1158
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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Preparation of a photosensitive composite electrode for an electrolytic cell aimed at energy conversion and photoredox reactions was attempted using the method of dispersion plating. Watt's bath containing photosensitive silver bromide powder as the dispersoid was used for dispersion plating. The conditions of current density, pH, and the rotation rate of the plating bath were investigated for the codeposition of matrix and dispersoid for preferable surface of the photosensitive electrode. The AgBr content also changed when these conditions changed. It was proven that were optimum conditions. The AgBr content increased about 1.6 times by addition of cationic surface active agent in comparison with the case that was not added. The composite electrode showed photosensitivity on the cyclic voltammetry under illumination by chopped light of Xe discharging lamp.
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Shinji SHIIZAKI, Makoto NISHIZAWA, Tetsushi HOSODA, Hideo KAMEYAMA, Ik ...
2000 Volume 51 Issue 11 Pages
1159-1164
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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In order to obtain a SiO
2 layer as a catalyst support on a surface of aluminum, silica coating on an anodized aluminum plate has been investigated. The catalyst support plate was prepared by impregnating an anodized aluminum plate into silica sol and calcinating it. Results indicated that adding oxalic acid to silica sol is effective in increasing the amount of silica, but adding other acids to the sol form a gel within 100h. The amount of silica applied increases with an increase in the temperature and the impregnation time. However, the amount decreased as the amount of alumina layer that had dissolved increased. The BET surface area of the coated specimens increased as the Si content increased. The maximum surface area relative to the apparent geometrical surface area was approximately 6000m
2·m
-2, which was more than twice that before coating, demonstrating that it is possible to apply the coating as a catalyst support. Results of plate characterization indicated that the alumina layer formed by anodizing dissolved in the presence of oxalic acids enlarging the pores that were then filled with silica particles.
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Makoto FUKUSHIMA, Takahiro YONESAKI, Kikuo TAKIZAWA, Takashi SUSAI
2000 Volume 51 Issue 11 Pages
1165-1167
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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The outer face of copper tubes used in a heat exchanger were coated with tin. The tubes were brazed with various types of solder in order to evaluate their corrosion resistance in a H
2S gas environment.
Results indicated that a copper tube coated with tin and brased with Sn-Pb and Sn-Ag demonstrates better corrosion resistance than conventional tubes.
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Sachiko ONO, Hideo KIJIMA, Noboru MASUKO
2000 Volume 51 Issue 11 Pages
1168-1169
Published: November 01, 2000
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Hideyuki KANEMATSU, Tatsumasa KOBAYASHI, Takeo OKI
2000 Volume 51 Issue 11 Pages
1170-1172
Published: November 01, 2000
Released on J-STAGE: October 30, 2009
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