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Volume 60, Issue 10
Displaying 1-11 of 11 articles from this issue
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Special Feature / Recent Status of Transparent Conductive Film and Its Alternative Materials
Reviews
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Takuji OYAMA2009 Volume 60 Issue 10 Pages 616
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSDownload PDF (1430K)
Reviews
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Hirohisa TAKAHASHI2009 Volume 60 Issue 10 Pages 622
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
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Junichi KATAYAMA2009 Volume 60 Issue 10 Pages 625
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
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Masami NAKAMOTO2009 Volume 60 Issue 10 Pages 631
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
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Hajime SHIBATA, Keigo MAEJIMA, Koji MATSUBARA, Hitoshi TAMPO, Akimasa ...2009 Volume 60 Issue 10 Pages 636
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
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Katsuro HAYASHI, Hideo HOSONO2009 Volume 60 Issue 10 Pages 641
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSDownload PDF (945K)
Topics
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Noriyuki YASUDA2009 Volume 60 Issue 10 Pages 647
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSDownload PDF (1116K)
Research Papers
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Yaichirou NAKAMARU, Tatsuyuki JOYA, Katsuhiko TASHIRO, Hideo HONMA2009 Volume 60 Issue 10 Pages 661
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSDeposition of a heavier coating requires more careful attention to process control to prevent nodules and pitting. Electroless nickel plating is sensitive to deficiencies such as pit, pinhole and nodules. These defects are generally caused by the bath ingredients and operating conditions. This study specifically examined that the defects free electroless Ni-P deposits for heavy coating. Results of our investigation show that selection of complexing agent, elimination of insoluble particles from the plating solution using fine filtration, selection of pH adjustor and operating conditions are critical factors to avoid these defects.View full abstractDownload PDF (1537K) -
Isao SHITANDA, Atsushi SATO, Kunihiro WATANABE, Masayuki ITAGAKI, Nobu ...2009 Volume 60 Issue 10 Pages 668
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSWe investigated electroless aluminum plating using AlCl3-1-ethyl-3-methylimidazolium chloride (AlCl3-EMIC) ionic liquid containing diisobutyl aluminum hydride (DIBAH) and BiCl3. The plating film was analyzed using X-ray diffraction and scanning electron microscopy. The aluminum films prepared with BiCl3 were smoother than those prepared without BiCl3. Furthermore, the plating bath stability was improved by addition of BiCl3.View full abstractDownload PDF (1213K)
Tecnological Reports
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Katsuhiro UNO, Mika EGUCHI, Taku SUZUKI, Yasuyuki TSUTSUMI2009 Volume 60 Issue 10 Pages 672
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSThe effects on cell performance of Nafion® content in 1 mg/cm2 Pt with a Pt and carbon mixture containing 50 wt.% Pt (50 wt.%Pt/C-1 mgPt/cm2) catalyst layers were studied under several humidified operating conditions at 80°C and 1 atm. The optimum Nafion® content for these conditions was 28-32 wt.% (0.76-0.95 mg/cm2). The value obtained using the 50 wt.%Pt/C catalyst was compared with reported values obtained using 20 wt.%Pt/C or 20 wt.%PtCr/C catalyst. The catalyst layer’s activation polarization with insufficient Nafion® decreases concomitantly with increased humidity, but that of a layer with excessive Nafion® increases with increased humidity.View full abstractDownload PDF (521K)
Letters
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Tsukasa SONODA, Naoyuki ANDO, Yoshihisa FUJIHIRA2009 Volume 60 Issue 10 Pages 676
Published: October 01, 2009
Released on J-STAGE: April 20, 2010
JOURNAL FREE ACCESSDownload PDF (635K)
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