Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Volume 65, Issue 5
Displaying 1-6 of 6 articles from this issue
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Special Feature / Intellectual Property and Patent for Surface Finishing
Reviews
Research Papers
  • A New Formation Route to form High-adhesion Polytetrafluoroethylene / Epoxy resin / SUS304 Interfaces through Plasma-assisted Morphological and Molecular Designs
    Nobuyuki ZETTSU, Kazuya YAMAMURA, Yushi IDUTSU, Hajime WAGATA, Shuji O ...
    2014 Volume 65 Issue 5 Pages 227-233
    Published: May 01, 2014
    Released on J-STAGE: May 01, 2015
    DOIhttps://doi.org/10.4139/sfj.65.227
    JOURNAL FREE ACCESS
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    Polytetrafluoroethylene (PTFE) is used in quake-absorbing structures because of its low friction characteristic. Because of its low surface energy, however, a pristine PTFE surface exhibits difficulty adhering to other substances. Consequently, PTFE surface normally requires some pretreatment such as chemical modification before adhesion. We herein propose a new surface modification route for adhesion enhancement of PTFE/epoxy resin interfaces using plasma-assisted morphological and molecular designs. Plasma processing methods under air and in water were used to introduce the peroxide radical and porous structures onto the PTFE surface. Subsequently, a polyethyleneimine derivative having primary amino groups at the molecular end in the side-chain was chemically modified by graft copolymerization to introduce reactive functional groups on the surfaces against epoxy resin-based glue. We achieved enhancement of T-peel strength between the PTFE substrate/ epoxy resin/ SUS substrate of 9.3 N/mm, which exceeds the T-peel strength obtained from conventionally used sodium-naphthalene processing (9.1 N/mm).
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Tecnological Reports
  • Photo-Activation Bonding of Cyclo-Olefin Polymer Plates: Evaluation of the Bonding Strength and Application to Micro-Fluidic Chips
    Yoshinao TANIGUCHI, Yong Jong KIM, Machiko HAGIOI, Yoshihiro TAGUCHI, ...
    2014 Volume 65 Issue 5 Pages 234-239
    Published: May 01, 2014
    Released on J-STAGE: May 01, 2015
    DOIhttps://doi.org/10.4139/sfj.65.234
    JOURNAL FREE ACCESS
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    For application to synthetic resin parts and to the fabrication of microfluidic devices made of cyclo-olefin polymer (COP), an adhesiveless bonding technology was developed: photo-activation bonding. A Xe excimer lamp irradiating vacuum ultraviolet (VUV) light of 172 nm wavelength was used as a light source for COP surface modification. The surface modification procedure is extremely simple. A COP plate placed in air with atmospheric pressure is irradiated with the VUV light. Based on VUV photochemistry assisted with atmospheric oxygen, a modified layer including large amounts of polar functional groups (-OH, -CHO, -COOH, etc.) is formed on the COP plate. The VUV-modified COP plates were bonded at a low temperature through attractive interactions between the modified layers on the COP plates without deforming the plates＇ preformed microstructures. A strength test of bonding was conducted to elucidate the effects of surface modification and bonding conditions such as VUV-irradiation distance (dVUV), VUV-irradiation time (tVUV), bonding pressure (PB), bonding temperature (TB), and bonding time (tB).
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