Circuit formation by a semi-additive process of copper films on glass was investigated. Copper films were produced on a glass substrate by direct electroless copper plating on a 20-30-nm-thick copper inclusive titanium oxide catalytic adhesion layer formed earlier on the glass substrate surface using a sol-gel method. After seed layer deposition, galvanic deposition thickened the copper film to 10 μm. Formation of L / S ＝ 50/50 μm to 200/200 μm copper circuit patterns on the glass substrate was then demonstrated, where adhesion was maintained throughout the process. The copper-inclusive titanium oxide adhesion layer was removed completely from the glass substrate surface without notably altering the glass surface morphology using a sodium hydroxide 100 g / L, trisodium citrate 5 g / L solution etching solution. Furthermore, in post electroless Ni-P plating, extraneous deposition was prevented by complete removal of the titanium oxide adhesion layer.

The voltage endurance of anodic oxide films of aluminum formed in contact with a conductive polymer with ionic liquids（ILs）was characterized for application to aluminum solid electrolytic capacitors. The breakdown potential was evaluated by measuring the current under increasing applied voltage with a constantly ascending rate（100 mV/s）. Anodized films that were formed in contact with polyethylenedioxythiophene（PEDOT）containing or moistened with ILs exhibited superior voltage endurance to that found for films without ILs. Further measurements of breakdown potentials for aluminum with pre-formed oxide revealed various characteristics of anodized films formed in contact with solid electrolyte combined with ILs of various kinds. These results indicate PEDOT/ILs complex solid electrolyte as a promising mAterial for use in high voltage solid electrolytic capacitors.