巻号一覧
21 巻, 3 号
選択された号の論文の8件中1～8を表示しています
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光沢ニッケルメッキの性状におよぼす主要因の研究 (第3報)永井 淑晴, 杉山 卓之輔, 柳原 護, 斎藤 昭三, 矢作 充由1970 年 21 巻 3 号 p. 113-118
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーEffects of organic and metallic impurities in bright nickel plating bath on the corrosion resistance and surface appearance of nickel-chromium plating were examined.
Organic compounds were the substances supposed to be produced by oxidation or reduction of 2-butyne-1·4 diol. Metallic impurities included Cu (II), Zn (II), and Mn (II).
CASS and SO2 tests were conducted on the corrosion resistance for organic impurities, but CASS test only for metallic impurities.
The follwing conclusions were drawn from the results of experiments.
The accumulated oxidized impurities, in particular, acetylene-dicarboxylic acid, tartaric acid, an glycolic acid had worse effects on the properties of nickel-chromium plating than reduced impurities. The following results were obtained.
1) Decrease in corrosion resistance of ncikel-chromium platings.
2) Decrease in leveling power of nickel deposits.
3) Formation of milky semi-bright deposits.
It was suggested the allowable limits of the contents of metallic impurities with respect to corrosion resistance and appearance were as follows:
Zn (II) up to 0.05g/l Cu (II) up to 0.02g/l and Mn (II) up to 5g/l抄録全体を表示PDF形式でダウンロード (683K) -
高速度メッキの研究 (第1報)川崎 元雄, 水本 省三1970 年 21 巻 3 号 p. 119-125
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーCopper or nickel was electroplated by using a jet flow device, in which the electrolyte flowed through a nozzle in high speed jet dashing perpendicularly against the cathode specimen, and then flowed away. As the results of experiments, it was found that the maximum available current density was 100amp./dm2 or more at a jet flow rate of 200cm/sec.. The flow of electrolyte and other factors in practice were discussed.抄録全体を表示PDF形式でダウンロード (1531K) -
電解重合による金属表面処理の研究 (第9報)浅原 照三, 妹尾 学, 土屋 満1970 年 21 巻 3 号 p. 126-129
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーIt is well known that some molecular compound is formed by carbon tetrachloride and amine, and that the addition of the amine and copper to the telomerization system of carbon tetrachloride and vinyl compound affects the distribution of molecular weight of the telomers. The authors investigated the mechanism of dissolution of copper in carbon tetrachloride-amine system and applied this effect to the surface treatment of metals.
A local cell was formed among copper, carbon tetrachloride, and an aliphatic amine. When copper was dissolved in the solution, an active chemical species was formed, by action of which vinyl monomer was polymerized. The rate determining step in the local cell was pesumed to be the cathodic reaction, in which the electron was transferred from copper to carbon tetrachloride-amine complex, and trichloromethyl radical was formed.抄録全体を表示PDF形式でダウンロード (433K) -
朝野 秀次郎, 広前 義孝1970 年 21 巻 3 号 p. 130-134
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーThe electrochemically treated steel sheet, which had been plated in CrO3-H2SO4 bath of low concentration, revealed a film composed of two layers. One was foundation layer consisting of metallic chromium, and the other was a surface layer consisting of hydrated chromium oxide. The throwing power of the bath of low concentration was examined in this study.
The results of experiments were as follows.
The throwing power for the hydrated chromium oxided layer was very high, but the power for the metallic chromium layer was of the same grade as that of the same bath of high concentration.
The relation between the throwing power for these film layers and the conditions of plating was studied in detail.抄録全体を表示PDF形式でダウンロード (633K) -
椎尾 一, 兼松 弘, 近藤 守信1970 年 21 巻 3 号 p. 134-137
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーEC Test was conducted on Cu-Ni-Cr platings of various thicknesses, and the number of color spots (caused by corrosion) developed on the surface of each specimen was measured as far as possible. The relation between the number of developed color spots in EC Test and R.N. (Rating Number) was obtained on the assumption that CASS Test for 16hrs. is equivalent to EC Test for 2min. for the same specimen. Then, it was proved that the conventional two spot color developing method means 8.0 of R.N..
Furthermore, the values obtained by the above method were compared with those obtained by the weathering tests commonly conducted in Nagoya District. As the results, it was found that R.N. determined by EC Test will give proper values which are acceptable.抄録全体を表示PDF形式でダウンロード (446K) -
電着合金に関する研究 (第10報)青谷 薫, 故石田 隆1970 年 21 巻 3 号 p. 138-141
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーVarious compositions of zinc-iron alloy deposits were obtained from the sulfate bath containing ZnSO4, FeSO4, NH4Cl, and Al2 (SO4)3.
The compositions of these alloy deposits depended upon bath composition, pH, temperature, and current density. The iron contents of these deposits were generally increased with increase of iron concentration in the bath and drop of bath temperature as well as increase of current density and pH value. The iron contents of the alloys were lower than those in the baths, particularly in the baths of lower concentrations of iron. However, alloye of higher iron contents were deposited from the baths containing iron of about 70% or more. Other addition agents in the bath had little effects on the alloy compositions.
Corrosion resistance of these deposit was confirmed by salt spray test and it was found that 2.5% iron alloy had the highest resistance to white rust. The resistance of the deposits was remarkably lower when the iron content was more or less than 2.5%. It was observed that the possibility of the formation of white or red rust was higher in the deposits of higher iron contents.抄録全体を表示PDF形式でダウンロード (1203K) -
無電解銅メッキに関する研究 (第3報)広幡 兵伍, 老田 昌弘, 本城 克彦1970 年 21 巻 3 号 p. 142-146
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーAn automatic regulating apparatus for pH and concentrations of copper and formaldehyde in electroless plating bath was manufactured for trial. The purpose of the apparatus was to maintain the concentrations of ingredients at constant during the deposition of copper.
The apparatus was used in the plating baths containing 0.02 and 0.03mol/l of copper ion and the deposition of copper for about 5hrs. was repeated 10 times.
In the bath containing 0.02mol/l of copper, the concentrations of copper ion and formaldehyde were maintained at 0.019-0.025 and 0.15-0.22mol/l, respectively, and pH was adjusted in the range of 12.0-12.3 during the operation.
The deposition rate of copper was likely to be increased with the number of repeating times of deposition. It would be due to the effects of HCO2- and SO42- which were accumulated during the repeated depositions.
Accordingly, the addtion amount of the ingredients must be controlled, but the operating time may be changed in order to keep a constant thickness of the deposit for each time of deposition.抄録全体を表示PDF形式でダウンロード (712K) -
栖原 寿郎, 福田 重久, 伊藤 普1970 年 21 巻 3 号 p. 147-153
発行日: 1970/03/20
公開日: 2009/10/30
ジャーナル フリーPDF形式でダウンロード (4801K)
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