Reliability in soldering of multi-layer printed circuits depends upon solderability of the surface to be joined. Solderability of coatings on lead wires and copper foils was determined by minimum wetting-time test, spread-area test, Passel's contact angle test, and the rate of wetting in dip test.
Most of freshly prepared coatings exhibited high solderability. However, in practical, many assemblies are troubled by faulty soldering owing to poor solderability of coatings after storage.
Therefore, the soldering test after accelerated ageing was required for estimating the solderability after storage.
There was much dispersion in the results of soldering tests, which interrupted reproducibility. However, the soldering test afer accelerated ageing led to an accurate evaluation of solderability. Moreover the cause of solderability loss during storage was deduced from the accelerated ageing test.
The following conclusions were drawn by the tests:
(1) The coating of the highest solderability was electrodeposited tin-lead alloy, and the second was electrodeposited tin. Electrodeposited gold coating, which had ever been assumed to have high solderability, was not so excellent and especially at low temperatures.
(2) Poor solderability resulted from the following defects of deposited coatings:
(a) Organic and inorganic surface contaminations which were derived from additives in the plating bath.
(b) Porous surface having a large surface area.
(c) Pinholes and other defectives being produced under bad plating conditions.
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