巻号一覧
23 巻, 6 号
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田中 誠之1972 年 23 巻 6 号 p. 308-315
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーPDF形式でダウンロード (1157K) -
スルファミン酸浴による鉄電着 (第7報)上野 浩, 高木 終司, 清水 泰, 三輪 滋, 林 禎一1972 年 23 巻 6 号 p. 316-319
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーThis paper describes the effects of several factors upon codeposition-rate of nickel and iron, current efficiency, sectional microphotographs of co-deposits, and brightness of electrodeposits from nickel-iron sulfamate electrolytes.
The following results were obtained:
1) The nickel content of deposit and the number of pits were increased with the increase in Ni2+ concentration and decrease in Fe2+ concentration of the deposit.
2) Higher nickel content was obtained at higher bath temperatures and at lower values of pH and current density.
3) Higher current efficiency was obtained at higher values of Ni2+ concentration, pH, and current density.
4) The sectional microphotographs showed lamellar structure of deposits.
5) The deposits were brighter with the increase in current density by the addition of a brightener.抄録全体を表示PDF形式でダウンロード (1949K) -
千早 正, 浦尾 亮一, 高橋 正敏1972 年 23 巻 6 号 p. 320-324
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーInvestigations were made on the morphology and structure of Cr layers electrodeposited on the surface of copper single crystals by means of transmission electron microscopy and electron diffractiometry. The deposition was made in 250g/l solution of chromium trioxide containing 1% of sulfuric acid at 42°C for 1-180sec.
The results obtained were as follows:
1) Cr layers consisted of granular and plate crystals, which developed with the time of electrodeposition.
2) It was considered that granular crystals were usually formed in uneven positions such as pits, and plate crystals were usually formed in smooth parts of the copper substrates.
3) Granular crystals had no coherencies to the substrates; but most of plate crystals had some kinds of coherencies to the substrates.
4) Main coherencies between plate crystals and the substrates were usually as follows:
{111}‹110›Cu||{110}‹100›Cr
{110}‹110›Cu||{111}‹110›Cr
{100}‹110›Cu||{110}‹111›Cr
5) The sharpest diffraction pattern was observed in the deposit formed in 5-30sec. deposition.
6) The {211} twin spots in b. c. c. crystals were often observed when {100} surface of copper was used as substrate.抄録全体を表示PDF形式でダウンロード (2819K) -
浦井 茂雄, 田辺 良美1972 年 23 巻 6 号 p. 325-330
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーThe formation and morphology of nickel films deposited on iron substrate prepared by two different methods were studied by electron microscopy and electron diffractiometry.
One type was obtained by only the immersion of the iron substrate in the nickel solution; and the other type was obtained by instantaneous galvanic contact with aluminum at the early stage of immersion.
The behavior was somewhat different between the two types of films.
In the former type, the deposited films consisted of nebulous parts and black contrast parts which made Bragg reflection in the image of bright visual field.
In the latter type, granular crystals deposited at first, and then, nebulous films developed on the crystals. The population of the granular crystals was 2.4×1011cm-2 or less.
The black contrast crystals had the normal lattice constant of nickel.
Almost all of these crystals had (211) orientation at the early stage of deposition, but (110) orientated crystals as well as (211) crystals developed with the progress of time.
The both nebulous films obtained by the above two different methods consisted of fine nickel particles and a substance having diffuse Debye rings. As the time elapsed, the fine nickel particles in the nebulous films grew up to larger crystals showing black contrast.抄録全体を表示PDF形式でダウンロード (5075K) -
高速電着に関する研究 (第2報)星野 重夫, 呂 戊辰1972 年 23 巻 6 号 p. 331-335
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーThis paper describes the hardness and orientation of nickel deposits obtained by high speed plating method. The orientation was analyzed by the orientation index calculated from the intensity of X-ray diffraction.
The electrodeposition was conducted under the following conditions:
Composition of electrolyte: nickel sulfate 300g/l and boric acid 30g/l
Temperature of bath: 40-80°C
Flow rate of electrolyte: 0-8l/min
Current density 2-240amp/dm2
The following results were obtained:
1) The nickel deposits obtained by high speed plating method were generally orientated in (220) plane parallel to the substrate, but the deposits from Watts bath were orientated in (200) plane.
2) The orientation index of (220) was increased with the increase in current density, decrease in flow rate, and drop in bath temperature.
3) When saccharin or butynediol was added as a brightener to the bath, the both deposits from Watts bath and by the high speed plating method exhibited a tendency toward random orientation.
4) The hardness of nickel deposits by the high speed plating method was decreased with increase in current density and rise in bath temperature; but it was increased with increase in flow rate of electrolyte and by the addition of brighteness.抄録全体を表示PDF形式でダウンロード (603K) -
川勝 一郎, 有賀 正1972 年 23 巻 6 号 p. 336-342
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーCopper-phoshorus brazing alloys are used for soldering of copper and copper alloys.
The object of this study was to determine the wettability of copper-phosphorus brazing alloys on pure copper plates.
The wettability depended upon the state of copper plate surface, phosphorus content of alloy, brazing atmosphere, and surface tension of the alloy.
The principal results of experiments were as follows:
1) As for the effects of surface roughness on wettability, higher wettability was obtained with the increase in surface roughness in the range of its average value of 0.4-5.0μ.
2) The relation between the phosphorus content of the alloy and its wettability on the copper plate showed that the wettability was increased with the increase in phosphorus content of the alloy.
3) Effects of gas atmosphere on wettability was as follows. The relations between wettability and the range of brazing temperature in argon, nitrogrogen, and bydrogen gases were nearly identical. However, the wetted surface of the alloy was often rough in bydrogen gas atmosphere.
4) The surface tension was decreased with the increase in phosphorus content of coppr. For example, the surface tension was about 800dyn/cm when phosphorus content of copper was 7% in volume.抄録全体を表示PDF形式でダウンロード (2264K) -
ステンレス鋼のアルミニウム拡散被覆に関する研究 (第1報)光田 章一, 上田 重朋1972 年 23 巻 6 号 p. 343-347
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーChemical reactions in pack process using HCl as the first stage study of aluminum diffusion coating on 18Cr/10Ni/Ti stainless steel are discussed in this paper.
The results of experiments were as follows:
1) Aluminum diffusion coating brought about a weight increase of specimen.
2) The value for weight increase of specimen had little difference between atmospheres of hydrogen gas and argon gas.
3) A maximum value of weight increase of specimen was observed at a difinite flow rate of hydrogen gas at 1050°C.
4) As the results of calculation by equilibrium conversion, the reducing reaction was the most prominent among the following three reactions.
Substitution reaction AlCl3+3/2Fe=3/2FeCl2+Al
Reducing reaction AlCl3+3/2H2=3HCl+Al
Decomposition reaction AlCl3=3/2Cl2+Al
5) The maximum deposition rate of aluminum was obtained at 0.6 of hydrogen gas ratio in the reducing reaction.抄録全体を表示PDF形式でダウンロード (682K) -
原田 良夫1972 年 23 巻 6 号 p. 348-359
発行日: 1972/06/01
公開日: 2009/10/30
ジャーナル フリーPDF形式でダウンロード (4390K) -
1972 年 23 巻 6 号 p. 368a
発行日: 1972年
公開日: 2009/10/30
ジャーナル フリーPDF形式でダウンロード (90K) -
1972 年 23 巻 6 号 p. 368b
発行日: 1972年
公開日: 2009/10/30
ジャーナル フリーPDF形式でダウンロード (90K)
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