金属表面技術
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
27 巻, 11 号
選択された号の論文の10件中1~10を表示しています
  • 朝野 秀次郎, 日戸 元
    1976 年 27 巻 11 号 p. 562-568
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
  • 榎本 英彦, 中川 融
    1976 年 27 巻 11 号 p. 569-573
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Tin-nickel alloy was electrodeposited from pyrophosphate bath containing α-aminoacid. Bath composition and operating conditions were as follows;
    Bath composition Operating conditions SnCl2·2H2O 0.125M current density 0.5-1.5A/dm2 NiCl2·6H2O 0.125M Ph 8.0 K4P2O7·3H2O 0.5M temperature 50°C glycine 20g/l
    Tin-nickel alloy (72:28) was obtained with high current efficiency (92% at a current density of 1A/dm2), and good throwing power. The composition of the tin-nickel alloy does not seem to vary with the small changes of pH and temperature of the plating bath, and of the concentration of potassium pyrophosphate.
  • 清水 保雄, 田辺 良美
    1976 年 27 巻 11 号 p. 574-580
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Au, Pd and Au-Pd alloys, electrodeposited, respectively, from neutral chelate cyanide bath, ammonium phosphate complex bath and mixed bath of them were studied by utilizing T. E. M. and S. E. M. and also by measuring microhardness. Electron diffraction analysis revealed that the electrodeposited Au-Pd alloy formed a solid solution since, at the early stage of nucleation, solid solutions were formed over all alloy constituents. The lattice parameter of the alloys changed nearly according to Vegard's law. The nucleation density for alloy deposition was about 3×1011cm-2, and was nearly equal to that for Au or Pd deposition. Film growth by electrodeposition was of the following process; nucleation→island crystal→network crystal→plate crystal. Electrodeposits showed no orientation in the initial stage of nucleation, but growing to island or network crystal they gradually took an epitaxy with Cu substrate. The alloy films contained finer crystallites and more microtwines than that of individual Au or Pd. This effect is considered to relate with the increase of lattice strain caused by alloying. Alloy films of less than 50 at. % Pd showed smooth and fine surfaces, but those containing more Pd precipitated powdery, grayish-black and no adherent crystallites on their surfaces. Hardness of the alloy films increased with an increase in Pd content.
  • 吉村 長蔵, 広地 通明, 岩佐 剛政
    1976 年 27 巻 11 号 p. 581-585
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Effects of hydroxide on the film thickness and properties of anodized films have been investigated from V-T curves and measurments of pH on the anode. The results obtained were as follows:
    (1) The oxide films formed in alkaline solutions (sodium hydroxide, sodium phosphate, and sodium fluoride) in the presence of hydrogen peroxide were thicker than those formed in alkaline basic solutions.
    (2) From the measurements of pH and V-T curves, hydrogen peroxide seemed to be dissociated as follows. H2O2→H++HO2-, HO2-→H++O22-
    (3) Anodizing of aluminum-iron composite sheet (the area ratio of Al:Fe=100:1) in sodium hydroxide bath involving hydrogen peroxide provided thick and uniform films.
    (4) It was found that the oxide films formed in the alkaline hydrogen peroxide bath had better properties, with regard to alkali resistance and scratch hardness, than those formed in the bath without hydrogen peroxide.
  • 沖 慶雄, 小山 正泰
    1976 年 27 巻 11 号 p. 586-589
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Effects of five kinds of lead stearate and lead benzoate on photodegradation of polyvinyl chloride were studied. Considerably irregular molecular weight distribution curves, which were obtained by using gel permeation chromatography, were observed concerning zinc stearate and normal lead stearate. Molecular weight distribution curve of calcium stearate was not irregular, although 17% of gel matter had grown up. As far as dibasic lead stearate and lead benzoate were concerned, neither growing of gel matter nor decreasing of molecular weight was observed.
  • 東 敬, 福島 久哲, 大橋 秀次, 秋山 徹也
    1976 年 27 巻 11 号 p. 590-595
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Ni-Mo alloys were electrodeposited on copper cathode from the baths containing 0.22M of nickel sulfate, 0.05M of acid molybdate, 0.27M of tartrate (as a complexing agent) and ammonium hydroxide under the galvanostatic conditions, and effects of ammonium and sodium (or potassium) ions on the cathode current efficiency were studied. Ammonium and sodium (or potassium) ions seemed to have the important roles on the alloy deposition in the range of experimental conditions examined. Electrodeposition of alloys from sodium (or potassium) ion-free bath occurred with slight efficiency, however, the same types of alloys were obtained with higher efficiency from the bath containing sodium (or potassium) ion. The presence of an excess ammonium ion in bath was found to be detrimental to the alloy deposition, however, sodium ion seemed to facilitate the electro-deposition of alloy. Further, study of electroreduction of molybdate ion was carried out, and it was indicated that deposition of molybdenum lower oxide occurred with higher efficiency under the condition that Ni-Mo alloys were obtained with lower efficiency. Thus, affecting the formation process of molybdenum lower oxide during the electrodeposition of Ni-Mo alloys, ammonium and sodium ions appeared to influence the cathode current efficiency of the alloys.
  • 土肥 信康, 小幡 恵吾
    1976 年 27 巻 11 号 p. 596-600
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    The basic composition and operating conditions suitable for electroplating of bright tin-lead alloys from 2-propanolsulfonate bath were determined from the measurments of the bright area percentage of Hull Cell test panel, tin content in the alloy deposit, throwing power and current efficiency. The basic bath composition thus determined was as follows; total metal 20g/l, free acid 100g/l, non-ionic surface-active agent 20g/l, brightener (a condensation product of o-toluidine with acetaldehyde-20% solution in isopropyl alcohol) 20ml/l and formaline (37%) 8ml/l. Throwing power of the bath did not vary with the concentrations of bath components near the basic bath composition range. Current efficiency was about 70% for the basic bath composition and at a current density of 3A/dm2. It increased with increasing metal concentration and decreased with increasing concentration of the brightener and current density. Metal ratio in the deposit was nearly equal to that in the bath over the wide ranges of plating conditions and bath concentrations.
  • 武井 たつ子
    1976 年 27 巻 11 号 p. 601-606
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    This paper describes the properties of Ni(CF3COO)2-NH4Cl-EtOH solution and nickel deposit from the solution. The properties are compared with those of the electrodeposited nickel from Ni (CF3COO)2-NH4Cl-MeOH bath which were reported in previous paper. Coordination of NH4Cl with Ni2+ was in a molar ratio of 1:2 in the EtOH solution as in the MeOH solution. The current density range for obtaining smooth nickel deposits from the EtOH solution was narrower than that from the MeOH solution. The grain size and hardness of the nickel deposit obtained from the EtOH solution were slightly smaller and harder than those from the MeOH solution. But, the crystal structure of the nickel deposit from the EtOH solution was almost the same as that from the MeOH solution.
  • 大野 湶, 戸田 崇文, 今井 弘, 向 正夫
    1976 年 27 巻 11 号 p. 607-610
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    A new electroless copper plating bath containing iminodiacetic acid as a complex agent has been developed and applied to the plating on the sintered PbTiO3-PbZrO3 ceramic substrate. The deposition rate of copper onto ceramics from the new type bath was compared with that from the different baths containing EDTA or Rochelle salt as a function of plating time, pH value and formaldehyde concentration. It was found that the iminodiacetate bath composed of 0.026M copper sulfate, 0.12M iminodiacetic acid and 0.5M formaldehyde at pH12.5, gave a maximum deposition rate which was twice that in EDTA bath and six times that in Rochelle salt bath. Effects of stirring the electroless plating bath and various metallic substrate surfaces on the copper deposition rate were also discussed.
  • 稲垣 雅一, 上田 重朋
    1976 年 27 巻 11 号 p. 611-612
    発行日: 1976/11/01
    公開日: 2009/10/30
    ジャーナル フリー
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