The polarization behavior of cobalt in electroless cobalt plating baths has been studied by using DEAB, NaH
2PO
2 or NaBH
4 as reducing agent respectively. Polarization experiments, based on the mixed potential theory, were also made on the baths without the presence of either metallic ion or reducing agents so that to simulate the partial polarization curves. The rate of electroless cobalt plating decreased in the order of DEAB, NaH
2PO
2 and NaBH
4. The electroless plating potential for each system shifted to noble direction in the same order. It was found from the polarization curves that the rate of electroless cobalt plating increased with increasing concentration of DEAB but was not sensitive to Co
2+ concentration. On the other hand, in the baths containing NaH
2PO
2, the rate depended on the concentrations of either NaH
2PO
2 or Co
2+. The polarization curves, obtained by superposing the partial anodic and cathodic polarization curves, were not well consistent with those obtained in the complete plating baths. It is likely that the partial anodic reactions were affected by the presence of Co
2+ or cathodic reaction probably because of the change in pH at the interface and the formation of cobalt oxides, whereas the partial cathodic reaction was independent of anodic reaction. The measurement of the polarization resistance was made in the electroless plating baths. As was reported in the previous paper, the rate of electroless plating i
p1 is related to the polarization resistance Rp, thus i
p1=K/Rp where K is a constant. The present results also obeyed this relationship with the K value of 0.091. It is concluded that the instantaneous rate of electroless cobalt plating in the citrate bath containing DEAB can be also monitored by the polarization resistance method.
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