Gold-palladium-copper alloy plating from neutral EDTA solution was investigated. The plating bath consisted of 0.211M EDTA-2Na, 0.198M Na
2SO
3, 0.012M NaAsO
2i 0.021M Au(SO
3)
23-, 0.024M Pd (en)
22+ and 0-0.021M CuSO
4. The plating was carried out at temperature: 25°C, 50°C, pH: 7-10, current density: D.C. 0.1-3.0A·dm
-2 and agitation: 0-2000rpm. The content of gold in alloy deposits decreased and palladium, copper contents increased with increasing the current density. As the temperature of solution rised, gold content increased and palladium, copper contents decreased. Further, at lower pH than 8, the variation of the alloy deposit composition was small though gold content increased under strong stirring. Bright gold-palladium-copper alloy deposits were obtained under the extensive electrolytic condition. In the solution containing 0.021M Au(SO
3)
23-, 0.024M Pd (en)
22+ and 0.0084M CuSO
4, the alloy deposits of 72.4 Au, 12.8 Pd, 14.8 Cu Wt% was obtained under condition of pH 8, 50°C and D.C. 1.0A·dm
-2 and the current efficiency was 76.6% and the electrodeposit crystal size was about 212Å long. The hardness of the gold-palladium-copper alloy deposits was about 400VHN and wear resistance was greater than that of a 22K (carats) gold-nickel alloy deposits.
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