The electrochemical and morphological effects of minute amount of lead, thallium, arsenic, cobalt, indium or nickel ions on the electrodeposition of gold from acidic gold plating baths have been systematically investigated. Heavy metal ions, Pb
2+ or Tl
+, increased the current efficiency of gold electrodeposition, especially at low current density, and changed the morphology of the electrodeposit. On the other hand, Co
2+, In
3+ and Ni
2+, which easily form alloys with gold in electrodeposition, decreased current efficiency and reduced grain size, so that a bright, smooth deposit was obtained. However, AsO
2- ion, which acts as a brightener in gold sulphite plating baths, had unsatisfactory brightening effect in acidic gold plating baths.
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