金属表面技術
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
38 巻, 11 号
選択された号の論文の7件中1~7を表示しています
  • 南 直樹, 高野 早苗, 中西 和美
    1987 年 38 巻 11 号 p. 510-517
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
  • 田村 隆之, 安田 幸夫
    1987 年 38 巻 11 号 p. 518-523
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    The effect of a brightener on the electrodeposition of Sn-Ni alloy plated from acidic chloride baths has been studied by microscopic observation, cathodic polarization measurements and direct determination of the brightener adsorbed. The brightener used was N-(1-naphthyl) ethylenediamine dihydrochloride (NEDA). The amount of HCl-free NEDA adsorbed in the alloy deposits was at most about 2% and varied with current density and bath composition, whereas the metal composition of the deposits remained almost unaltered despite variations in the metal ion concentration in the bath. Even if the NEDA content in the alloy deposits was very low, hydrogen evolution potential on the deposits shifted to a far nobler potential than on NEDA-free deposits, which resulted in the depolarization of the bright alloy surface. It is considered that the codeposited hydrogen atoms on the surface inhibited the crystal growth of the metals, thus facilitating the brightening effect of NEDA. SEM observations showed that the bright deposits from additive baths had fine uniform grains of about 0.2-0.3μm, whereas the dull deposits from additive-free baths had coarser grans of about 3-4μm.
  • 松田 均, 鷹野 修, 四谷 真一
    1987 年 38 巻 11 号 p. 524-528
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    The magneto-optic properties of electroless Co-Ni-W-Re-P plating films were studied, and on the basis of preliminary experiments, a Co-Ni-W-Re-P system containing sodium tartrate as a complex agent was chosen. The films deposited from the bath had an hcp structure with the c-axis perpendicular to the film plane.
    The Kerr-rotation angle (θk) and reflectivity (R) showed generally a constant value at film thickness above 0.1μm. Reflectivity varied from 60 to 80% for all specimens investigated. The Kerr-rotation angle varied over a wide range with the plating condition and it was affected considerably by Co2+/Ni2+ ion ratio in the bath. Both the (002) plane orientation and saturation magnetization (Ms) influenced the Kerr-rotation angle and it was increased by decrease in Δθ50 and increase in Ms. The maximum value of θk obtained in this study was 0.26.
  • 小林 勝義, 馬 有仁, 柴崎 安一
    1987 年 38 巻 11 号 p. 529-534
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    The corrosion of copper in sulfuric acid/hydrogen peroxide etching solutions with n-alkylamines was studied by means of weight loss and polarization techniques at various flow rates of the etching solution.
    The addition of n-butylamine to the basic etching solution (2mol H2SO4+2mol H2O2+1kg H2O) led to both the polarization of the anodic partial reaction and the depolarization of the cathodic partial reaction, so that the corrosion potential shifted toward the positive potential. Methylamine acted as a corrosion inhibitor. Ethylamine, n-propylamine and n-butylamine changed from corrosion inhibitors to corrsion accelerators with an increase in the flow rate of the etching solution. Increases in the concentration of amines other than methylamine raised the effects of both corrosion inhibition at lower flow rates and corrosion acceleration at higher flow rates. Increases in the corrosion rate gave rise to increases in the etch factor.
    Amines added to corrosion solutions had several benefits; 1) they retarded the decomposition of hydrogen peroxide; 2) they shortened the etching time due to increases in the corrosion rate; 3) they inceased the etch factor; and 4) they inhibited the corrosion of the metal surface being etched.
  • 千田 伸, 瀬畑 浩之, 久保田 昇, 佐藤 栄一
    1987 年 38 巻 11 号 p. 535-539
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    An investigation was conducted on the reaction mechanism of palladium electrodeposition from ethylenediamine-palladium (II) complex solutions, and on the effect of thallium. Cathodic current-potential curves that were free from concentration overvoltage ηc were obtained using a rotating disk electrode. The slope of the Tafel relation was about 0.10V⋅decade-1 in the potential range of -0.60- -0.80V (SCE), and the charge transfer coefficient α and activation energy EAC of the discharge process were determined to be 0.37 and 55.52kJ/mol, respectively. Thallium was deposited on the electrode and acted as active sites for palladium electrodeposition. The follow electrodeposition mechanism is proposed
    T1+→T1(≡A)
    Pd(en)22+soln+A_??_Pd(en)0.52+ads⋅A+3/2en
    Pd(en)0.52+ads⋅A+2e_??_Pdads⋅A+1/2en
    Pdads⋅A→Pdcrys+A
    and/or
    Pdads⋅A→Pdcrys⋅A
    That is to say, electrodeposition of Pd(en)22+ proceeded through Pd(en)0.52+ as an intermediate, and it is thought thet tha discharge of this intermediate is the rate determining process.
  • 河上 護, 百瀬 治, 梶山 佳孝
    1987 年 38 巻 11 号 p. 540-543
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    The titanium was treated electrolytically in a molten salt bath at current density is 200-600A/m2 in the temperature range of 1123-1223K for 10.8-54ks.
    It was confirmed by X-ray diffraction that the surface product was TiB2. The dual phase structures of a white layer and a black layer were observed on the cross section of treated specimen. The thickness of the boronized layer increased exponentially with treated temperature and parabolically with treated duration and decreased with icnreasing of current density. The maximum surface hardness was obtained treated at a current density 400A/m2.
  • 児嶋 佳世子
    1987 年 38 巻 11 号 p. 544-548
    発行日: 1987/11/01
    公開日: 2009/10/30
    ジャーナル フリー
    Analysis of pyrophosphate, orthophosphate and dimercaptothiadiazole (brightening agent) in a copper pyrophosphate bath and mercaptobenzothiazole-S-propanesulfate (brightening agent) in an acidic copper sulfate bath was carried out by isotachophoresis using hydrochloric acid and ε-amino-n-caproic acid as the leading electrolyte and sodium caproate as the terminal electrolyte.
    Simultaneous analysis of sulfate and chloride in an acidic copper sulfate bath was carrid out by isotachophoresis using calcium hydroxide as the leading electrolyte and sodium acetate as the terminal electrolyte.
    Catalytically poisoning metals and copper can be simultaneously analyzed by isotachophoresis, but poisoning metals were not detected in commercially available plating baths.
    The concentrations of pyrophosphate, orthophosphate and copper in plating baths obtained by isotachophoresis were virtually identical to almost the same as to those found by titration.
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