We developed a rotating drum method for preparing composite particles of PTCR (positive temperature coefficient of resistivity) and solder. The mechanism and the rate of composition by the rotating drum method are studied, because the surface coverage of the PTCR particles is an important factor in order to fabricate thin and flexible PTCR sheets from the composite particles. Since semiconducting BaTiO
3 is irregular in size and shape, zirconia balls of 200, 400 and 650μm are used. Composition rapidly proceeded during the initial first hour. After 1 hour, the solder particles adhered at a constant rate. The rate decreased linearly with a decrease of particle size, and the composition of 200μm zirconia balls did not progress after 1 hour. Analysis of solder particles showed that the average particle size of residual solder increased with the processing time. Observation by SEM showed that the surface of solder particles was marred by collisions resembling the shot peening after 12 hours' processing of composition. It was concluded that the change of composition rate at 1 hour processing is due to the variation of size distribution and work hardening of solder particles.
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