In this part 4, plasma-enhanced chemical vapor deposition (PECVD) methods, which are film deposition methods via excited states of species in a plasma, are explained. Unlike thermal CVD methods, PECVD methods are film deposition technologies that use excited states. As a result, it is possible to deposit films without being affected by the activation energy (activation enthalpy ΔH) that is a limitation of thermal CVD methods. PECVD has the following features : (1) It is possible to produce metastable films such as diamond. (2) It is possible to achieve high-speed film deposition at low temperatures.
PECVD methods are classified into capacitively coupled and inductively coupled types. Capacitively coupled types are the basic type of PECVD method because they can create uniform plasma. On the other hand, inductively coupled types can generate a lot of molecular dissociation species due to the high-density plasma. This allows for film deposition that makes effective use of activated species.
Plasma generation uses commercial frequency radio waves (13.56 MHz). This requires high-frequency technology such as impedance matching.
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