The transmission speed of printed circuit boards designed for high-speed transmission exceeds 10 GHz(20 Gbps), but the need increases for additional efforts to realize ultra-high-speed transmission. Selection of low dielectric constant materials and skin effects of wiring conductors are important for improvement of high-speed signal transmission characteristics. To date, to cope with skin effects during formation of the wiring conductor, attention has been devoted to reducing the roughness of the matted surface of the copper foil. Therefore, efforts to smooth the surface side of the wiring conductor had not been assigned priority. As described herein, related to the skin effect, we investigated the influence of the four-side surface roughness of the wiring conductor and wiring dimension parameters on the transmission loss in the ultra-high-speed region. Therefore, we examined factors for producing high-speed circuit wiring.
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