Proper disposition of impurities, etc., in plating bath is prerequisite, for obtaining the best plating result. The authors have been investigating, from the commercial point of view, the effect of impurities in chemical plating bath and galvanic action at the starting period of plating for the purpose of getting the good adhesion of the deposit, the result of which is reported as follows:
1) As in the case of electroplating impurrities in chemical plating bath such as ferrous, cupric and zinc ion have bad effect upon the appearance of plating and plating bath.
2) As for the ferrous ion, even its very small amount existing in the bath not only deteriorates the surface of the deposit, but makes the bath turbid.
3) Presence of cuprie ion in plating bath results in the appearance of black streak and brown color on the surface of the deposit.
4) The presence of zinc iron in plating bath makes the plating efficiency very low.
5) Galvanic action generates by the contact of iron with aluminum improves the adhesion of the deposit even on copper and copper alloys.
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