The strength reliability of solder joints in electronic product is evaluated by conducting thermal cycle test. However, the test takes a very long time to complete the evaluation. Therefore, Highly Accelerated Life Test (
HALT
) is expected to be conducted as an accelerated test of thermal cycle test.
HALT
gives a product a severe loading which combines fast thermal cycles with mechanical vibration until the product fails, to identify its weak point in a short time. Recently, a study shows that the strength reliability of solder joints in electronic products can be evaluated by
HALT
with a simulated sample of electronic products in a shorter time than by thermal cycle test. However, there are not any studies which discuss the fatigue mechanism of the solder joints in actual electronic products under
HALT
loading condition. In this study, the solder joints in an IC package were subjected to a severe loading which combined fast thermal cycles with mechanical vibration by using a
HALT
machine. As a result, it was confirmed that the fatigue destruction mode of
HALT
was the same as that of thermal cycle test, and
HALT
could be completed approximately 27 times faster than an ordinary thermal cycle test. In addition, to discuss the fatigue behavior of the solder joints under thermo-vibration combined environment of
HALT
, FEM analyses were conducted using FEM software ANSYS. The results showed that the equivalent plastic strain range increased under thermo-vibration combined environment of
HALT
in comparison with thermal cycle test.
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