Development of Fine Line Adhesion Technology for Super High Resolution Dry Film Photo Resist

Abstract

We developed a super high resolution DFR which can be used for the mass production of the L/S=15/15 micron wiring pattern. The design concept was the combination of easy developing of un-exposed resist and swelling control of exposed fine line resist. We confirmed vacuum lamination improves fine line adhesion characteristics under the low exposure condition. And we found suitable developer condition makes super fine line pattern (L/S=7/7 micron). The resist stripping performance after copper plating of fine line pattern was very good.