Preparation and Evaluation of Next-Generation Ni Multilayer Ceramic Chip Capacitor Electrode Using Ni Flake Powder

Abstract

Flake-type Ni powder was studied to enable further thinning of the MLCC Ni electrode. Considering the manufacturing process for the present ceramic capacitor, it is necessary to make the firing shrinkage action of what similar to that of a dielectric green sheet. Nickel flake paste with added organometallic acid salt of the same composition as nickel flake powder and ceramics was considered. According to the results of our study, the sintering of electrode paste films is inhibited when using Ni flake paste with an organometallic acid salt in contrast to using Ni spherical paste. A similar result has been obtained by observing of the surface structure of sintered bodies.