Abstract
This paper describes a method and results of in situ measurement of stress for Co/Pd multilayer films deposited by rf sputtering. An optical non-contact displacement detector is set at the behind of the substrate. The substrate is hold at one of the ends of the substrate and the detector is set at near the free end of substrate. Change of displacement (d) between the detector and the substrate caused by the bending of the substrate which corresponds to the stress in the film. For Co single film, stress is tensile and its value is almost constant with increasing film thickness, while in Pd single film, stress is also tensile at the beginning of the deposition and it takes a minimum value at near the 80 Å of Pd thickness and then it changes to compressive. For Co(4Å)/Pd(30Å) multilayer films deposited directly on the glass substrate, at very beginning of the deposition, the stress in Pd and Co layers are tensile and compressive, respectively. This distribution of stress is gradually changed with the progress of deposition. After the deposition of over 20 periods of Co/Pd, the stress in the Pd and Co layers are changed to compressive and tensile, respectively.
