携帯電話PA用インピーダンス整合器への適用を目的としたCoFeB/ポリイミドハイブリッド薄膜コプレーナ線路の低損失化

中山 英俊; 山本 知広; 溝口 裕子; 佐藤 敏郎; 山沢 清人; 三浦 義正; 三宅 裕子; 秋江 正則; 上原 裕二; 遠藤 恒雄; 宗像 誠; 八木 正昭

doi:10.3379/jmsjmag.29.667

Contributed Papers

Investigation of Suppression of the Insertion Loss of a CoFeB/Polyimide Hybrid Thin-Film Coplanar Line for Impedance Matching in a Mobile Phone Power Amplifier Module

H. Nakayama, T. Yamamoto, Y. Mizoguchi, T. Sato, K. Yamasawa, Y. Miura, Y. Miyake, M. Akie, Y. Uehara, T. Endo, M. Munakata, M. Yagi

Author information

H. Nakayama
Nagano National College of Technology
T. Yamamoto
Faculty of Engineering, Shinshu University
Y. Mizoguchi
Faculty of Engineering, Shinshu University
T. Sato
Faculty of Engineering, Shinshu University
K. Yamasawa
Faculty of Engineering, Shinshu University
Y. Miura
Faculty of Engineering, Shinshu University
Y. Miyake
Fujitsu Limited
M. Akie
Fujitsu Limited
Y. Uehara
Fujitsu Limited
T. Endo
Renesas Technology Corporation
M. Munakata
Energy Electronics Laboratory, Sojo University
M. Yagi
Energy Electronics Laboratory, Sojo University

Keywords: hybrid thin-film coplanar transmission-line, impedance matching device, mobile phone, CoFeB magnetic film, polyimide dielectric film

JOURNAL OPEN ACCESS

2005 Volume 29 Issue 6 Pages 667-674

DOI https://doi.org/10.3379/jmsjmag.29.667

Details

Abstract

Suppression of the insertion loss of a CoFeB/polyimide hybrid thin-film coplanar line for impedance matching in a mobile phone power amplifier module was investigated. To suppress the insertion loss of the CoFeB/polyimide hybrid coplanar line, various techniques were investigated on the basis of device simulations and fabrication. As a result, it was found that the introduction of a thick copper signal line, a multilayer magnetic film structure and optimum width of the magnetic film were effective for lowering insertion loss. Insertion loss per quarter wavelength of the fabricated devices was below 0.5 dB in the frequency range from 1 to 1.5 GHz.

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