Journal of the Japan Society for Abrasive Technology

Journal of the Japan Society for Abrasive Technology

Published by The Japan Society for Abrasive Technology

798 registered articles
(updated on November 05, 2025)

Online ISSN : 1880-7534
Print ISSN : 0914-2703
ISSN-L : 0914-2703

JOURNAL PEER REVIEWED FREE ACCESS
J-STAGE Data

2025 Volume 69 Issue 10

Extraction of fine bamboo fibers by end milling of oval bamboo cylinder: KAITO TANAKA, REO KITAZAKI, YUTARO NAKAHARA, MASAO NAKAGAWA, TOSHIKI HIROGAKI, HIROMICHI NOBE
Control of chip adhesion using photocatalytic reaction of titanium dioxide Akira MIZOBUCHI, Kota HONDA, Takahiro TAGUCHI, Shinya MATSUMOTO, Tohru ISHIDA

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Most viewed articles (October 2025)

1

Effect of surface roughness of titanium formed by angled fine particle peening on cell adhesion and proliferation

Released on J-STAGE: May 08, 2021 | Volume 64 Issue 10 Pages 527-532

Rina SUZUKI, Ai MOMOZAWA, Daigo TERUTSUKI, Yutaka KAMEYAMA, Sara TOYAMA, Gen-u TAKAHASHI
2

The study of the cutting phenomenon by visualization of orthogonal cutting behavior

Released on J-STAGE: August 11, 2006 | Volume 49 Issue 1 Pages 24-29

Takuya TAKESHIMA, Noboru MORITA, Shigeru YAMADA, Noboru TAKANO, Tatsuo OYAMA
3

The impact of wafer edge profile on polishing performance in silicon wafer manufacturing

Released on J-STAGE: July 09, 2010 | Volume 53 Issue 2 Pages 105-110

Akira FUKUDA, Tetsuo FUKUDA, Hirokuni HIYAMA, Manabu TSUJIMURA, Toshiro DOI, Syuhei KUROKAWA
4

Effect of cation on ultrafine bubbles and the removal mechanism of biofilm

Released on J-STAGE: October 01, 2023 | Volume 67 Issue 4 Pages 212-217

Hiroko YAMADA, Hiromu OKOSHI, Yuichiro TERADA, Keita SHIMADA, Tsunemoto KURIYAGAWA, Masayoshi MIZUTANI
5

Development of high-efficient CMP process of SiC wafers for power electronics

Released on J-STAGE: November 25, 2016 | Volume 60 Issue 8 Pages 454-459

Shinya HIRANO, Kenji KAWATA, Hirokuni ASAMIZU, Tomohisa KATO

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