Journal of Japanese Society for Laser Dentistry
Online ISSN : 2185-6702
Print ISSN : 0917-7450
ISSN-L : 0917-7450
Adhesive Properties of Resin Bonding System to Er: YAG or CO2 Lased Dentin
Does the resin bonding system exhibit its full adhesive performance to lased dentin?
Morioki FUJITANI
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JOURNAL FREE ACCESS

2006 Volume 17 Issue 2 Pages 74-80

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Abstract

Laser ablation [Er: YAG (Erwin Adverl®, 60mJ/10pps), CO2 (Topal®, 1W/0.3sec)] of dentin reduces the adhesive properties of resin bonding systems. The so-called “laser-etching” might not be effective in promoting adhesion. By TEM observations of non-decalcified specimens, such morphological changes as observed in the acid-etched dentin surface could not be detected in the subsurface layer of the lased dentin. It was mechanically weakened due to the formation of structural defects and heat-denatured layer, leading to considerably lower adhesive properties. Significantly lower bond strength was obtained in the wedge-shaped defects compared with the flat surfaces. The configuration factor (C-factor) might be an important factor especially for the adhesion to lased dentin.
However, high-energy laser ablation of dentin (Er: YAG: 250mJ/lOpps, CO2: 3W/0.3sec) hardly reduced the bond strength. In the subsurface layer of low-power lased dentin (Er: YAG: 60mJ/1 pps, CO2: 1W/0.3sec), TEM observations of decalcified specimens revealed that amorphous matrix substances containing denatured collagen fibers were generated (Er: YAG: 3-4μm, CO2: 1-2μm). On the other hand, in the high power-lased dentin (Er: YAG: 250mJ/1pps, CO2: 3w/0.3sec), such morphological structure that could hardly be distinguished from sound dentin (Er: YAG) or the subsurface dentin layer having both little amorphous matrix and torn collagen fibers with cross-striation (CO2) was observed. The effects of high-energy laser ablation might be limited to the superficial layer.
It was concluded that laser-etching might not be effective in promoting adhesion, and that the amount of irradiation energy should be considered when evaluating the adhesive properties of resin bonding systems.

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