Fabrication of Molded Interconnect Devices Using Sacrificial Material of Biodegradable Plastic

Abstract

MID （Molded Interconnect devices）had been developed as three dimensional circuit boards, and currently are in use as multiband antennas in mobile phones as a functional device. Aiming at application of MID to mechatronic devices such as actuators and sensors, the authors research on novel production technologies required for the purpose. This paper introduces a novel production method using sacrificial material that allows circuit structuring on various shaped surfaces, especially shadowed surface, which was not possible with conventional methods. The method has realized a peeling strength of 0.99N/mm, of a fine copper quality obtained by excluding oxygen while eluting the sacrificial material.