A method for debonding polyimide film and ultra-thin glass from glass substrate is proposed. The method is based on the surface activated bonding approach extended to a modified bonding process using Si nano-adhesion layer. The surfaces of both polyimide film and the glass substrate are activated by Si nano-adhesion layer deposited in vacuum and bonded in situ at room temperature whereas only the ultra-thin glass surface is treated with Si nano-adhesion layer, and bonded in vacuum to glass substrate after exposure to N₂ gas. Even after a thermal treatment such as TFT process over 400 to 500°C, they can be debonded by mechanical peeling at room temperature.