Developing an application for 3D IC chip stacking technology
Released on J-STAGE: March 19, 2016 |
Volume 9
Issue 1
Pages 1-14
Masahiro AOYAGI, Fumito IMURA, Fumiki KATO, Katsuya KIKUCHI, Naoya WATANABE, Motohiro SUZUKI, Hiroshi NAKAGAWA, Yoshikuni OKADA, Tokihiko YOKOSHIMA, Yasuhiro YAMAJI, Shunsuke NEMOTO, Bui Thanh TUNG, Melamed SAMSON