Abstract
Liquid crystalline epoxy resin with mesogenic group was synthesized and its adhesive bonding properties were compared with that of bisphenol-A type epoxy resin. Bonding strength of the former resin system showed higher value than that of the latter resin system. It was suggested that the high bonding strength of the liquid crystalline epoxy resin system was due to the large creep deformation of this resin system along the stress direction. Bonding strength of the cured systems has a maximum peak with the progress of curing, because of the increase in the internal stress occurred with the curing shirnkage of epoxy resins.
