Abstract
Chemical curing-shrinkage and thermal mismatch generated the residual stresses on bonded structures during curing process and heat cycle process. Evaluating of residual stress is necessary to make sure of the reliability of equipments. But the behavior of residual stress in bonded structures is not cleared. In this study, the residual stress of epoxy adhesives was measured by the bimetal specimen during curing process and heat cycle process. In this experiment, room temperature (20C) curing and 50C after curing were given. Moreover, heating and cooling cycles were given. Relationship between the residual stress and temperature was obtained. As a result, following conclusions were obtained; [1] Chemical curing-shrinkage increases the residual stress during room temperature curing. [2] Retained chemical curing-shrinkage increase the residual stress during heating process of after curing, [3] In case of after curing, the residual stress during heating process is not equal to that during cooling process, because a coefficient of thermal expansion of resin during heating process is larger than that during cooling process. [4] Maximum residual stress generate after cooling process of after curing.
