Analysis of Destruction Property of Glass/Resist/Cu/Al/Glass Multilayer Structure

Abstract

When the resist adhesive layer inserted in the Glass/resist/Cu/Al/Glass multilayer structure is heated, the micro void due to VF (Viscous Fingering) phenomenon is formed in the resist adhesive layer during the solvent evaporation. The purpose of this paper is to analyze the destruction property of the Glass/resist/Cu/Al/Glass multilayer structure with regard to the stress concentration and stress relaxation of the resist adhesive layer due to void formation. The destruction strength of the resist adhesive layer inserted in the multilayer structure was measured by using the peeling tester. As the result, the destruction strength of the multilayer structure increases with increasing the number of void in the adhesive layer. Moreover, the Al/Glass interface destruction occurs extensively around the each void. It is considered that the destruction phenomena were due to stress relaxation of resist adhesive layer and to stress concentration around the void, respectively.