Abstract
Quantitative analysis of collapse property of an electron beam (EB) resist pattern ranging from 60 to 152 nm width and 220 nm height is demonstrated experimentally. By directly applying a load to a top corner of resist pattern with a micro-cantilever tip, resist line pattern adhering on a substrate can be collapsed easily accompanying slight residue formation. The load required for collapsing pattern decreases linearly with decreasing the pattern width of the resist pattern. The pattern collapse occurs in the cause of insufficient cohesion of the resist material.
