Abstract
Bipheniltypeepoxideresins,latelyappliedtomoldingcompoundforICpackage,donothavethecarbonbridgebetweenaromaticringsandhavehighdensityoftt-electron・Internalstressofthesecuredresinscanbedecreasedbyintroducingbiphenylstructureintothenetwork,becausethestackingstructureofmoleculescausesthehighmobilityofsegments.Inordertoinvestigatetheeffectsofn-electroninteractiontomechanicalproperty,wecalculatedthemoleculeorbitalofseveralreactantsandevaluatedthedistanceofsegmentsinthesecuredresinsbyX-raydiffraction.Theresultshowedthatn-electroninteractionattributetotheorientationofepoxyresinnetworkchains,anditcanbethecauseofdecreaseintheelasticmodulusandthermalexpansionofthecuredresin.Theseexperimentresults,weappliedtosynthesizethemoldingcompoundforICpackagethathashighadhesiontometalframeandlowinternalstress,eventuallyveryhighpotentialforIRreflowresistance.
