Abstract
Diallyl phthalate resin is used as electrical and electronic parts, and insulation materials forelectronic parts, because of excellent heatresistance, electrical insulation under high temperature and highhumidity, and good dimensional stability.However, the improvement of adhesive property of diallylphthalate resin, to the metal insert department of the electrical and electronic parts and the metalwhich is used for the leadflame of electronic parts is demanded with the miniaturization and theprecision of various electrical and electronic parts in recent years.In this study, allyl ester compounds having sulfur containing group that strengthens interfacial interaction to the metal, were synthesizedto improve the adhesive property of diallyl phthalate resin.They were used as a modifier of diallylphthalate resin and the adhesive property was evaluated.By modification with allyl ester compoundhaving disulfide unit, the T-peel adhesive strength to copper was increased up to about 3.5 times andthe lapshear adhesive strength to copper was increased up to about 2 times compared with diallylphthalate resin.It is suggested that the improvement of interfacial interaction between modified diallylphthalate resin and metal from the observation of copper surface after T-peel adhesive strength testby a scanning electron microscope.
