Journal of The Adhesion Society of Japan
Online ISSN : 2187-4816
Print ISSN : 0916-4812
ISSN-L : 0916-4812
Technical Report
Photocurable Pressure Sensitive Adhesives for Nanoimprint Processes
Hironobu FUJIMOTOToshio SUGIZAKI
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2010 Volume 47 Issue 3 Pages 113-118

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Abstract
Nanoimprint technologies have been received considerable attention due to their attractive features such as capabilities of the rapid fabrication and large scale patterning of nano/microstructures using patterned master substrates. In this paper,we report pressure sensitive adhesives designed for a UV-type nanoimprint process (PSA-NIP) ,in which the pressure sensitive adhesive sheet is applied to a patterned master stamp in order to transfer its pattern to the surface of the sheet,and then the sheet is photocured by irradiating ultraviolet light to maintain the transferred pattern and peel the cured sheet from the stamp. In dynamic rheological analyses and evaluating resolution of transferred patterns by using atomic force microscope (AFM) ,the adhesives composed of acrylic copolymers having vinyl groups and the photocurable resin havingrelatively high glass transition temperature (Tg,ca. 187℃) ,tricyclodecandiacrylate (TCDDA) ,show significant improvements in feature fidelity and thermal resistance.
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© 2010 The Adhesion Society of Japan
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