Abstract
Various components of organic and inorganic compounds are used and connected through the proper procedures in a semiconductor package.Especially,semiconductor devices of metal silicon,printed circuit board (P.C.B.), and accessories are adhered each other by die bond material which are mainly consisted of organic material. The adhesion of the components is known to effect on the reliability of the devices. This lead to develop the new die bond materials including epoxy thermoset systems in which silane coupling agents are added to improve adhesive strength,and some of those are commerdaily available.On the basis of the information mentioned above,a new epoxy thermoset system,in which several silane coupling reagents are added into the die bonding materials containing phosphine and imidazole compounds as the curing accelerators,are examined here. The effects of the additives on adhesive properties are discussed in the aspects of reactivity of the functional groups in the silane couplers through electric charge distribution of the each molecules.
