Analysis of Dispersion Behavior of Silane Coupling Agents in Epoxy Resin Compositions

Abstract

Dicing and die bonding tapes (adhesive films) are used to the processes of semiconductor packages. For performing the processes efficiently, it is required to improve interface adhesive intensities between silicon chips and adhesive films. Thus, silane coupling agents are added to adhesive films. However, whether dispersion behavior of silane coupling agents has an effect on adhesive properties have little been revealed so far. Therefore, in this paper, we studied the influence of dispersion behavior of silane coupling agents to the adhesive properties so as to control interface adhesive intensity. The adhesive films, containing the different amounts and chemical structures of silane coupling agents, were analyzed by X-ray photoelectron spectroscopy (XPS) and XPS with sputtering using C60 cluster ions in some cases. The results of the XPS measurements indicated that silane coupling agents showed a different tendency to localize in the vicinity of the adhesive film surface and the tendency depends on the structure and the quantity of silane coupling agents. These findings suggested that the dispersion behavior of silane coupling agents in the vicinity of adhesive film surface was important to control the adhesive properties.