2018 Volume 54 Issue 5 Pages 169-186
Recently, in order to reduce weight and cost of automobiles, smartphones, digital cameras, etc. as well asaircraft, the necessity of adhesion and bonding technology of many different materials such as metal, CFRP,ceramics, resin and the like has increased , and various bonding technologies have been developed.Conventional joining methods using adhesives require man-hours such as fixation of adherends and curingtime of the adhesive. Also, most of engineering plastics are crystalline and poor in adhesion. In order to solvethese problems, recently, a method of generating fine irregularities on the surface of the adherend by wetetching or laser treatment and directly injection-molding the resin thereon, a method of melting and bondingthe resin in the vicinity of the bonding interface with irradiating with laser beam, friction of the adherendmetal, ultrasonic waves, a hot plate or the like, and a method of chemically bonding the metal and the resintreated with the molecular adhesive by injection molding or pressurizing and heating, were developed. In these cases, the molten resin plays a role of an adhesive and does not require heating for curing as in thecase of adhesion, and the resin is solidified by cooling, so that there is an advantage that it can be joined in ashort time.In addition, as a chemical bonding method without using an adhesive, methods such as "coupling reactionmethod", "gas adsorption dissimilar material bonding method", and "water vapor-vacuum ultraviolet bondingmethod" were developed. The main joining methods of these are classified according to the joining principleand outlined.
