Electro-conductive Inks and Pastes:Preparation and Structural Analyses

Abstract

In this paper, we would like to discuss on electro-conductive inks and pastes including metal nanoparticles and/or fine particles as the conductive materials. This paper introduces the particle preparation strategies, dispersion method and investigation of the detailed structure during sintering. In particular, low-temperature sintering of copper fine particle pastes is focused. The cutting edge points of the conductive inks and pastes, that is, oxidation prevention, dispersing methods, and the use of MODs will be discussed.