2021 Volume 57 Issue 7 Pages 264-271
An epoxy resin having a triphenylene ether structure（ BGPBZ） was synthesized and the physical properties
of a cured polymer obtained by curing with 4,4’-dihydroxydiphenyl ether（ DHDE） were evaluated. BGPBZ
gave a crystalline cured polymer with a melting point of 203.4℃ , which was 17.8℃ higher than that of epoxy
resin having a diphenylene ether structure（ DGDPE）. The thermal expansion coefficient of the crystalline
cured polymer is 4.4×10-5 ℃-1, which is 30％ lower than that of the amorphous cured polymer. In addition, the
thermal conductivity is 0.32 W/m･K, which is about 1.5 times that of the amorphous cured polymer.
