2021 Volume 57 Issue 9 Pages 363-369
An epoxy resin having an amide structure（ DGBA） was synthesized and the physical properties of a cured
polymer obtained by curing with 4,4’-dihydroxydiphenyl ether（ DHDE） were evaluated. DGBA gave a crystalline
cured polymer with a melting point of 202.9℃, which was 15.5℃ higher than that of epoxy resin having
a diphenylene ether structure（ DGDE）. The Tg of the DGBA polymer in the DMA measurement was 133.2℃,
which was 37.3 ℃ higher than that of the DGDE polymer. The DGBA polymer had a significantly low thermal
expansion coefficient of 2.7×10-5℃-1, and the thermal conductivity is 0.29 W/m･K, which is 1.45 times that of
the bisphenol A type polymer.
